Invention Grant
US08741690B2 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
有权
封装的半导体器件，包括密封剂嵌入半导体芯片，包括接触焊盘
- Patent Title: Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
- Patent Title (中): 封装的半导体器件，包括密封剂嵌入半导体芯片，包括接触焊盘
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Application No.: US13453787Application Date: 2012-04-23
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Publication No.: US08741690B2Publication Date: 2014-06-03
- Inventor: Thorsten Meyer , Rainer Leuschner , Gerald Ofner , Reinhard Hess , Recai Sezi
- Applicant: Thorsten Meyer , Rainer Leuschner , Gerald Ofner , Reinhard Hess , Recai Sezi
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacturing a semiconductor package includes embedding a semiconductor chip in an encapsulant. First contact pads are formed on a first main face of the semiconductor package and second contact pads are formed on a second main face of the semiconductor package opposite the first main face. A diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, where x is a pitch of the second contact pads in micrometers.
Public/Granted literature
- US20120208319A1 Packaged Semiconductor Device with Encapsulant Embedding Semiconductor Chip that Includes Contact Pads Public/Granted day:2012-08-16
Information query
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