发明授权
- 专利标题: MEMS element, and manufacturing method of MEMS element
- 专利标题(中): MEMS元件和MEMS元件的制造方法
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申请号: US13322990申请日: 2011-02-24
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公开(公告)号: US08742872B2公开(公告)日: 2014-06-03
- 发明人: Tomohiro Iwasaki , Keiji Onishi , Kunihiko Nakamura
- 申请人: Tomohiro Iwasaki , Keiji Onishi , Kunihiko Nakamura
- 申请人地址: JP Osaka
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2010-062187 20100318
- 国际申请: PCT/JP2011/001051 WO 20110224
- 国际公布: WO2011/114628 WO 20110922
- 主分类号: H03H9/02
- IPC分类号: H03H9/02 ; H03H9/10 ; H03B5/30 ; H03H3/007 ; H01L21/62 ; H01L23/02 ; H03H9/24 ; B81B3/00 ; B81B7/00 ; B81C1/00
摘要:
In a MEMS device having a substrate 1, a sealing membrane 7, and a movable portion 3 of beam and an electrode 5 which have a region wherein they overlap with a gap in perpendicular to a substrate 1 surface, a first cavity 9 is on the side of the movable portion 3 in the direction perpendicular to the surface of the substrate, and a second cavity is the other cavity, and an inner surface a of a side wall A in contact with the electrode 5, of the first cavity 9, is positioned more inside than an inner surface b of a side wall B in contact with the electrode 5, of the second cavity 10, in the direction parallel to the substrate surface, such that the movable portion 3 does not collide with the electrode 5 when mechanical stress is applied from outside to the sealing membrane 7.
公开/授权文献
- US20120075030A1 MEMS ELEMENT, AND MANUFACTURING METHOD OF MEMS ELEMENT 公开/授权日:2012-03-29
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