Invention Grant
- Patent Title: Low-profile microneedle array applicator
- Patent Title (中): 薄型微针阵列敷料机
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Application No.: US13611942Application Date: 2012-09-12
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Publication No.: US08758298B2Publication Date: 2014-06-24
- Inventor: Adam S. Cantor , Franklyn L. Frederickson , Peter R. Johnson , Ted K. Ringsred
- Applicant: Adam S. Cantor , Franklyn L. Frederickson , Peter R. Johnson , Ted K. Ringsred
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Main IPC: A61M5/00
- IPC: A61M5/00

Abstract:
An applicator used to apply microneedle arrays to a mammal. In particular, an application device for applying a microneedle device to a skin surface comprising a flexible sheet having a raised central area attached to the microneedle device and a supporting member at or near the periphery of the flexible sheet, wherein the flexible sheet is configured such that it will undergo a stepwise motion in the direction orthogonal to the major plane of the sheet.
Public/Granted literature
- US20130006219A1 LOW-PROFILE MICRONEEDLE ARRAY APPLICATOR Public/Granted day:2013-01-03
Information query
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