发明授权
- 专利标题: Method for extreme ultraviolet electrostatic chuck with reduced clamp effect
- 专利标题(中): 减少夹具效应的极紫外线静电卡盘的方法
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申请号: US13602618申请日: 2012-09-04
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公开(公告)号: US08765582B2公开(公告)日: 2014-07-01
- 发明人: Chia-Hao Hsu , Chia-Chen Chen , Tzung-Chi Fu , Tzu-Wei Kao , Yu Chao Lin
- 申请人: Chia-Hao Hsu , Chia-Chen Chen , Tzung-Chi Fu , Tzu-Wei Kao , Yu Chao Lin
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L21/3215
摘要:
The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a front surface and a backside surface; integrated circuit features formed on the front surface of the semiconductor substrate; and a polycrystalline silicon layer disposed on the backside surface of the semiconductor substrate.
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