Invention Grant
- Patent Title: Multi-region processing system
- Patent Title (中): 多区域处理系统
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Application No.: US13106059Application Date: 2011-05-12
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Publication No.: US08770143B2Publication Date: 2014-07-08
- Inventor: Rick Endo , Kurt Weiner , Indranil De , James Tsung , Maosheng Zhao
- Applicant: Rick Endo , Kurt Weiner , Indranil De , James Tsung , Maosheng Zhao
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/50 ; B05B1/28 ; B05D1/10 ; B05D1/00 ; B05D3/00 ; H05H1/24 ; C23F1/00 ; H01L21/306 ; C25B11/00 ; B05B15/04 ; B05B15/12
Abstract:
The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.
Public/Granted literature
- US20110209663A1 Multi-Region Processing System and Heads Public/Granted day:2011-09-01
Information query
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