Invention Grant
- Patent Title: Detecting defects on a wafer
- Patent Title (中): 检测晶圆上的缺陷
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Application No.: US13196758Application Date: 2011-08-02
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Publication No.: US08775101B2Publication Date: 2014-07-08
- Inventor: Junqing Huang , Yong Zhang , Stephanie Chen , Tao Luo , Lisheng Gao , Richard Wallingford
- Applicant: Junqing Huang , Yong Zhang , Stephanie Chen , Tao Luo , Lisheng Gao , Richard Wallingford
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA Milpitas
- Agent Ann Marie Mewherter
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
Methods and systems for detecting defects on a wafer are provided.
Public/Granted literature
- US20130035876A1 DETECTING DEFECTS ON A WAFER Public/Granted day:2013-02-07
Information query
