Invention Grant
- Patent Title: Vertical contact for shielded sockets
- Patent Title (中): 屏蔽插座的垂直触点
-
Application No.: US13627128Application Date: 2012-09-26
-
Publication No.: US08777675B2Publication Date: 2014-07-15
- Inventor: Chia-Pin Chiu
- Applicant: Chia-Pin Chiu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01R13/24
- IPC: H01R13/24

Abstract:
A conductive contact includes a hollow cylinder, a spring strip and a contact head.
Public/Granted literature
- US20140087590A1 Vertical Contact for Shielded Sockets Public/Granted day:2014-03-27
Information query