发明授权
- 专利标题： Liner layers for metal interconnects
- 专利标题（中）： 用于金属互连的衬里层
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申请号： US12973773申请日： 2010-12-20
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公开(公告)号： US08779589B2公开(公告)日： 2014-07-15
- 发明人: Harsono S. Simka , Daniel J. Zierath , Michael G. Haverty , Sadasivan Shankar
- 申请人： Harsono S. Simka , Daniel J. Zierath , Michael G. Haverty , Sadasivan Shankar
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/48 ; H01L21/768 ; H01L23/532 ; H01L21/44
摘要：
Electrical interconnects for integrated circuits and methods of fabrication of interconnects are provided. Devices are provided comprising copper interconnects having metallic liner layers comprising silver and a second component, such as, lanthanum, titanium, tungsten, zirconium, antimony, or calcium. Methods include providing a substrate having a trench or via formed therein, forming a silver alloy layer, comprising silver and a second component selected from the group consisting of lanthanum, titanium, tungsten, zirconium, antimony, and calcium, onto surfaces of the feature, depositing a copper seed layer, and depositing copper into the feature.
公开/授权文献
- US20120153478A1 LINER LAYERS FOR METAL INTERCONNECTS 公开/授权日：2012-06-21