发明授权
- 专利标题： Integrated circuit packaging system with island terminals and method of manufacture thereof
- 专利标题（中）： 岛岛集成电路封装系统及其制造方法
-
申请号： US13188456申请日： 2011-07-21
-
公开(公告)号： US08802501B2公开(公告)日： 2014-08-12
- 发明人: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu , Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- 申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu , Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/48
- IPC分类号： H01L21/48
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.
公开/授权文献
信息查询
IPC分类:
