公开(公告)号：US20120018866A1

公开(公告)日：2012-01-26

申请号：US13188456

申请日：2011-07-21

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供一个封装桨叶，其具有在桨叶顶侧下方的上孔，所述上孔由具有曲面的上非水平侧限定; 形成邻近包装桨的端子; 将集成电路安装在桨叶顶侧; 并在上孔内形成封装。

公开(公告)号：US08802501B2

公开(公告)日：2014-08-12

申请号：US13188456

申请日：2011-07-21

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L21/48

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供一个封装桨叶，其具有在桨叶顶侧下方的上孔，所述上孔由具有曲面的上非水平侧限定; 形成邻近包装桨的端子; 将集成电路安装在桨叶顶侧; 并在上孔内形成封装。

公开(公告)号：US20130099367A1

公开(公告)日：2013-04-25

申请号：US13526802

申请日：2012-06-19

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua ,  Emmanuel Espiritu

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua ,  Emmanuel Espiritu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  Y10T29/4921 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a partially removed portion including: a conductive pattern having a lower surface on a top frame surface of the leadframe, a contact protrusion and a support lead on the lower surface of the conductive pattern, the support lead for supporting the partially removed portion of the leadframe during an encapsulation process, and a contact pad on a bottom surface of the contact protrusion; mounting an integrated circuit die above the conductive pattern; applying an encapsulation on the integrated circuit die and the conductive pattern, the lower surface of the conductive pattern exposed from the encapsulation; and removing at least a portion of the leadframe to form a contact lead and expose a bottom surface of the encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有部分去除部分的引线框架，其包括：导体图案，其具有在引线框架的顶部框架表面上的下表面，接触突起和在下表面上的支撑引线 导电图案，用于在封装工艺期间支撑引线框架的部分去除部分的支撑引线以及接触突起的底表面上的接触焊盘; 在导电图案上方安装集成电路管芯; 在集成电路管芯和导电图案上施加封装，导电图案的下表面从封装暴露; 以及去除所述引线框架的至少一部分以形成接触引线并暴露所述封装的底表面。

公开(公告)号：US09293351B2

公开(公告)日：2016-03-22

申请号：US13526802

申请日：2012-06-19

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua ,  Emmanuel Espiritu

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua ,  Emmanuel Espiritu

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  Y10T29/4921 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a partially removed portion including: a conductive pattern having a lower surface on a top frame surface of the leadframe, a contact protrusion and a support lead on the lower surface of the conductive pattern, the support lead for supporting the partially removed portion of the leadframe during an encapsulation process, and a contact pad on a bottom surface of the contact protrusion; mounting an integrated circuit die above the conductive pattern; applying an encapsulation on the integrated circuit die and the conductive pattern, the lower surface of the conductive pattern exposed from the encapsulation; and removing at least a portion of the leadframe to form a contact lead and expose a bottom surface of the encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有部分去除部分的引线框架，其包括：导体图案，其具有在引线框架的顶部框架表面上的下表面，接触突起和在下表面上的支撑引线 导电图案，用于在封装工艺期间支撑引线框架的部分去除部分的支撑引线以及接触突起的底表面上的接触焊盘; 在导电图案上方安装集成电路管芯; 在集成电路管芯和导电图案上施加封装，导电图案的下表面从封装暴露; 以及去除所述引线框架的至少一部分以形成接触引线并暴露所述封装的底表面。

公开(公告)号：US09059151B2

公开(公告)日：2015-06-16

申请号：US13187505

申请日：2011-07-20

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

IPC分类号： H01L23/495 ,  H01L21/98 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L21/4832 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an opening surrounding the upper structure, the tie bars connected to the upper structure and exposed on the base side; connecting an integrated circuit to the upper protrusions; applying an encapsulant over the integrated circuit, over the upper structure, and in the opening with the base side exposed; removing the tie bars exposing a first surface and a second surface of the encapsulant below the first surface, and forming a die paddle from the upper structure and exposed from the second surface; and removing the leadframe from the base side forming island terminals from the upper protrusions exposed from the second surface and isolated from the die paddle.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有上部结构的引线框架，上部突起和背向上部结构和上部突起的基部侧面; 在引线框架中形成带有围绕上部结构的开口的连接杆，连接杆连接到上部结构并在基部侧露出; 将集成电路连接到上突起; 在所述集成电路上，在所述上部结构上以及在所述开口中施加密封剂，所述基部侧露出; 去除所述连接杆，将所述密封剂的第一表面和第二表面暴露在所述第一表面下方，以及从所述上部结构形成模片并从所述第二表面露出; 以及从所述基座侧移除所述引线框架，所述引线框架从形成岛端子的所述上突出部暴露于所述第二表面并与所述管芯焊盘隔离。

公开(公告)号：US08803300B2

公开(公告)日：2014-08-12

申请号：US12889911

申请日：2010-09-24

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

IPC分类号： H01L23/495

CPC分类号： H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.

摘要翻译： 一种制造集成电路封装系统的方法，包括：形成具有管芯连接板和通过连接件连接的接触焊盘的引线框架; 在芯片附接板上安装集成电路管芯; 在所述引线框架和所述集成电路管芯上形成封装主体，所述封装主体包括从所述封装主体露出的所述管芯附接板，所述接触焊盘和所述连接部分的部分; 通过蚀刻掉接触垫和管芯附接板之间的连接来形成暴露的边缘; 以及在暴露的边缘上沉积耐焊层。

公开(公告)号：US08604596B2

公开(公告)日：2013-12-10

申请号：US13071433

申请日：2011-03-24

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/495

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2224/45099

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a hole, a lead extension, and an exterior pad under the lead extension with the hole abutting the lead extension; connecting an electrical interconnect between an integrated circuit and the lead extension; forming an encapsulation over the integrated circuit and surrounding the electrical interconnect and through the hole; and removing a bottom portion of the lead frame resulting in a stand-off lead from the lead extension with the exterior pad on the stand-off lead.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有孔，引线延伸部和引线延伸部下方的外部焊盘的引线框架，所述孔邻接所述引线延伸部; 连接集成电路和引线延伸部之间的电互连; 在集成电路上形成封装并围绕电互连并穿过孔; 并且移除引线框架的底部部分，从而使引线延伸部处于与支撑引线上的外部焊盘相对的间隔引线。

公开(公告)号：US08404524B2

公开(公告)日：2013-03-26

申请号：US12884073

申请日：2010-09-16

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

IPC分类号： H01L21/00

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a hole, a recess, and a pad, the hole over the recess; mounting an integrated circuit to the package paddle; forming a lead having a bottom surface coplanar with a bottom surface of the pad, the lead isolated from the package paddle; attaching connectors directly on the integrated circuit, the lead, and the package paddle; and forming an encapsulation covering the integrated circuit and within the hole and the recess.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有孔，凹槽和垫的封装桨，该凹槽上方的孔; 将集成电路安装到封装焊盘上; 形成具有与所述垫的底表面共面的底表面的引线，所述引线与所述封装焊盘隔离; 将连接器直接连接在集成电路，引线和封装焊盘上; 以及形成覆盖所述集成电路并且在所述孔和所述凹部内的封装。

公开(公告)号：US08241965B2

公开(公告)日：2012-08-14

申请号：US12859049

申请日：2010-08-18

申请人： Henry Descalzo Bathan ,  Flynn Carson ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

发明人： Henry Descalzo Bathan ,  Flynn Carson ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

IPC分类号： H01L21/00

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle; forming a pad extension having a spacing to the package paddle; forming a lead adjacent the pad extension, the pad extension between the package paddle and the lead; forming a conductive layer directly on and between the package paddle and the pad extension; and connecting an integrated circuit to the pad extension and the lead, the integrated circuit over the package paddle.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供封装焊盘; 形成具有到所述包装桨的间隔的垫延伸部; 在所述焊盘延伸部附近形成引线，所述焊盘在所述封装焊盘和引线之间延伸; 直接在封装焊盘和焊盘延伸部之间形成导电层; 并将集成电路连接到焊盘扩展部分和引线，封装焊盘上的集成电路。

公开(公告)号：US08203201B2

公开(公告)日：2012-06-19

申请号：US12732465

申请日：2010-03-26

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a paddle, an inner post adjacent to the paddle, a jumper pad, and an outer post, with the jumper pad between the inner post and the outer post; mounting an integrated circuit over a paddle first side, the paddle first side co-planar with the outer post; connecting a first jumper interconnect between the integrated circuit and the jumper pad; connecting a second jumper interconnect between the jumper pad and the outer post; and forming an encapsulation over paddle, the integrated circuit, the first jumper interconnect, the jumper pad, and the second jumper interconnect.

摘要翻译： 一种制造集成电路封装系统的方法，包括：形成桨，邻近桨的内柱，跳针垫和外柱，其中跨接垫位于内柱和外柱之间; 将集成电路安装在桨叶第一侧上，所述桨叶第一侧与所述外柱共面; 连接集成电路和跳线焊盘之间的第一跳线互连; 在跳线焊盘和外部柱之间连接第二跳线互连; 以及在焊盘，集成电路，第一跳线互连，跳线焊盘和第二跳线互连之间形成封装。