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发明授权
US08803312B2 Method for manufacturing semiconductor devices having a glass substrate 有权
具有玻璃基板的半导体器件的制造方法

Method for manufacturing semiconductor devices having a glass substrate
摘要：
A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallization region is formed on the machined second surface of the semiconductor wafer.
摘要（中）：

公开了半导体器件的制造方法。 提供了具有与第一表面相对的第一表面和第二表面的半导体晶片。 提供了在接合表面处具有至少一个空腔和开口的第一玻璃基板。 将第一玻璃基板接合到半导体晶片的第一表面，使得金属焊盘被布置在第一玻璃基板的相应空腔或开口内。 加工半导体晶片的第二表面。 在半导体晶片的加工的第二表面上形成至少一个金属化区域。

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