Invention Grant
- Patent Title: Printed circuit boards with embedded components
- Patent Title (中): 带嵌入式组件的印刷电路板
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Application No.: US13683997Application Date: 2012-11-21
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Publication No.: US08804363B2Publication Date: 2014-08-12
- Inventor: Jahan Minoo , Anthony P. N. Bidmead , Michael Nikkhoo
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group
- Agent G. Victor Treyz; Michael H. Lyons
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H04R1/02 ; H04R1/04

Abstract:
Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.
Public/Granted literature
- US20130077813A1 Printed Circuit Boards with Embedded Components Public/Granted day:2013-03-28
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