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    Printed circuits with staggered contact pads and compact component mounting arrangements
    1.
    发明授权
    Printed circuits with staggered contact pads and compact component mounting arrangements 有权
    具有交错接触垫和紧凑型元件安装布置的印刷电路

    公开(公告)号：US09001522B2

    公开(公告)日：2015-04-07

    申请号：US13674834

    申请日：2012-11-12

    Applicant: Apple Inc.

    Inventor： Wyeman Chen ,  Michael Nikkhoo ,  Amir Salehi

    IPC: H05K7/10 ,  H01R12/00 ,  H05K1/11 ,  H05K13/04 ,  H01R12/52 ,  H05K3/34

    CPC classification number: H01R9/095 ,  H01R12/526 ,  H05K1/111 ,  H05K3/3415 ,  H05K13/0465 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2203/1572 ,  H05K2203/304 ,  Y02P70/611 ,  Y10T29/49144

    Abstract: Electronic devices may be provided with printed circuits to which integrated circuits and other electrical components may be mounted. A first printed circuit may have a first surface with an array of contact pads arranged in rows and columns. Each column of contact pads may have a series of contact pads separated by gaps. The contact pads in each column may be staggered with respect to the contact pads in adjacent columns such that each contact pad in a given column is horizontally adjacent to associated gaps in the adjacent columns. A component may be mounted to an opposing surface of the printed circuit such that it overlaps one of the gaps between the staggered contact pads. By mounting the component to portions of the first printed circuit that do not overlap the staggered contact pads, the risk of damaging the electrical component during solder reflow operations may be minimized.

    Abstract translation: 电子设备可以设置有可以安装集成电路和其他电气部件的印刷电路。 第一印刷电路可以具有以行和列排列的接触焊盘阵列的第一表面。 每列接触垫可具有由间隙分开的一系列接触垫。 每列中的接触垫可以相对于相邻列中的接触垫交错，使得给定列中的每个接触垫水平邻近相邻列中的相关间隙。 组件可以安装到印刷电路的相对表面，使得它与交错接触垫之间的间隙中的一个重叠。 通过将组件安装到不与交错接触垫重叠的第一印刷电路的部分，可以最小化在回流焊接操作期间损坏电气部件的风险。

    Printed Circuit Boards with Embedded Components
    4.
    发明申请
    Printed Circuit Boards with Embedded Components 有权
    带嵌入式组件的印刷电路板

    公开(公告)号：US20130077813A1

    公开(公告)日：2013-03-28

    申请号：US13683997

    申请日：2012-11-21

    Applicant: Apple Inc.

    Inventor： Jahan Minoo ,  Anthony P.N. Bidmead ,  Michael Nikkhoo

    IPC: H05K1/18 ,  H04R1/02 ,  H04R1/04 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/183 ,  H04R1/025 ,  H04R1/04 ,  H05K1/02 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0919 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10356 ,  H05K2201/10446

    Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.

    Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。

    Ultrasonic bonding
    5.
    发明授权
    Ultrasonic bonding 有权
    超声波接合

    公开(公告)号：US08800846B2

    公开(公告)日：2014-08-12

    申请号：US13752263

    申请日：2013-01-28

    Applicant: Apple Inc.

    Inventor： Michael Nikkhoo

    IPC: B23K1/06

    CPC classification number: B23K20/106 ,  B23K20/004 ,  B23K20/10

    Abstract: The described embodiment relates generally to the field of ultrasonic bonding. More specifically, an apparatus for bonding a number of wires directly to a metal substrate in a single operation without the use of any kind of adhesive or solder is disclosed. The apparatus is an ultrasonic bonder. The ultrasonic bonder has a horn with a cavity specifically sized for the number of wires to be bonded. The ultrasonic bonder is driven at a frequency that corresponds to a resonant frequency of the wires to be bonded.

    Abstract translation: 所描述的实施例一般涉及超声波接合领域。 更具体地，公开了一种用于在不使用任何种类的粘合剂或焊料的情况下在一次操作中将多根电线直接连接到金属基板的装置。 该装置是超声波接合器。 超声波焊接机具有具有针对要接合的导线数量而具有特定尺寸的腔的喇叭。 超声波接合器以对应于要接合的导线的谐振频率的频率被驱动。

    Printed circuit boards with embedded components
    7.
    发明授权
    Printed circuit boards with embedded components 有权
    带嵌入式组件的印刷电路板

    公开(公告)号：US08804363B2

    公开(公告)日：2014-08-12

    申请号：US13683997

    申请日：2012-11-21

    Applicant: Apple Inc.

    Inventor： Jahan Minoo ,  Anthony P. N. Bidmead ,  Michael Nikkhoo

    IPC: H05K1/18 ,  H04R1/02 ,  H04R1/04

    CPC classification number: H05K1/183 ,  H04R1/025 ,  H04R1/04 ,  H05K1/02 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0919 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10356 ,  H05K2201/10446

    Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.

    Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。

    Printed Circuits with Staggered Contact Pads and Compact Component Mounting Arrangements
    9.
    发明申请
    Printed Circuits with Staggered Contact Pads and Compact Component Mounting Arrangements 有权
    具有交错接触垫和紧凑型元件安装布置的印刷电路

    公开(公告)号：US20130122725A1

    公开(公告)日：2013-05-16

    申请号：US13674834

    申请日：2012-11-12

    Applicant: Apple Inc.

    Inventor： Wyeman Chen ,  Michael Nikkhoo ,  Amir Salehi

    IPC: H01R12/00 ,  H05K13/04

    CPC classification number: H01R9/095 ,  H01R12/526 ,  H05K1/111 ,  H05K3/3415 ,  H05K13/0465 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2203/1572 ,  H05K2203/304 ,  Y02P70/611 ,  Y10T29/49144

    Abstract: Electronic devices may be provided with printed circuits to which integrated circuits and other electrical components may be mounted. A first printed circuit may have a first surface with an array of contact pads arranged in rows and columns. Each column of contact pads may have a series of contact pads separated by gaps. The contact pads in each column may be staggered with respect to the contact pads in adjacent columns such that each contact pad in a given column is horizontally adjacent to associated gaps in the adjacent columns. A component may be mounted to an opposing surface of the printed circuit such that it overlaps one of the gaps between the staggered contact pads. By mounting the component to portions of the first printed circuit that do not overlap the staggered contact pads, the risk of damaging the electrical component during solder reflow operations may be minimized.

    Abstract translation: 电子设备可以设置有可以安装集成电路和其他电气部件的印刷电路。 第一印刷电路可以具有以行和列排列的接触焊盘阵列的第一表面。 每列接触垫可具有由间隙分开的一系列接触垫。 每列中的接触垫可以相对于相邻列中的接触垫交错，使得给定列中的每个接触垫水平邻近相邻列中的相关间隙。 组件可以安装到印刷电路的相对表面，使得它与交错接触垫之间的间隙中的一个重叠。 通过将组件安装到不与交错接触垫重叠的第一印刷电路的部分，可以最小化在回流焊接操作期间损坏电气部件的风险。

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