Invention Grant
- Patent Title: Multi-layer diaphragm
- Patent Title (中): 多层隔膜
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Application No.: US14042553Application Date: 2013-09-30
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Publication No.: US08807014B2Publication Date: 2014-08-19
- Inventor: Shinichi Nitta , Hiroshi Itafuji
- Applicant: CKD Corporation
- Applicant Address: JP Komaki-shi, Aichi
- Assignee: CKD Corporation
- Current Assignee: CKD Corporation
- Current Assignee Address: JP Komaki-shi, Aichi
- Agency: Beyer Law Group LLP
- Priority: JP2011-100012 20110427
- Main IPC: F04B43/02
- IPC: F04B43/02 ; B32B7/12 ; F16K7/12 ; F16J3/02 ; F04B43/04

Abstract:
This invention provides a multi-layer diaphragm which is for use in fluid devices and has excellent maintainability in addition to both operability and pressure resistance. This multi-layer diaphragm is provided with a first and second plate and with an elastic adhesive layer which binds together the first and second metal plates. The elastic adhesive layer has an elastic layer that is elastic in a direction which offsets the first and second metal plates from one another in the in-plane direction. The multi-layer diaphragm is provided with a metal mounting plate which, provided in a position allowing protrusion beyond the first and second metal plates in the outer edge direction, has a mounting unit for mounting to the fluid device.
Public/Granted literature
- US20140030480A1 MULTI-LAYER DIAPHRAGM Public/Granted day:2014-01-30
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