Invention Grant
- Patent Title: Methods for fabricating a conductor
- Patent Title (中): 制造导体的方法
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Application No.: US12017904Application Date: 2008-01-22
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Publication No.: US08813352B2Publication Date: 2014-08-26
- Inventor: James P. Huang , Namsoo P. Kim , Enrique V. Barrera , Chris A. Lundberg
- Applicant: James P. Huang , Namsoo P. Kim , Enrique V. Barrera , Chris A. Lundberg
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Armstrong Teasdale LLP
- Main IPC: B29C47/00
- IPC: B29C47/00 ; H01B1/24 ; H01B13/00
Abstract:
A method for fabricating a conductor includes providing a plurality of conductive nano-scale material elements, dispersing the nano-scale material elements within a resin to provide a resin-nano-scale material mixture, aligning the nano-scale material elements within the resin-nano-scale material mixture, and curing the resin-nano-scale material mixture.
Public/Granted literature
- US20080286560A1 HIGHLY CONDUCTIVE ELECTRICAL WIRES AND CONDUCTIVE STRIPS HAVING A REDUCED WEIGHT Public/Granted day:2008-11-20
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