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发明授权
US08822138B2 Composition for forming resist underlayer film for lithography including resin containing alicyclic ring and aromatic ring 有权
用于形成光刻用抗蚀剂下层膜的组合物，包括含有脂环族环和芳环的树脂

Composition for forming resist underlayer film for lithography including resin containing alicyclic ring and aromatic ring
摘要：
There is provided a resist underlayer film having both heat resistance and etching selectivity. A composition for forming a resist underlayer film for lithography, comprising a reaction product (C) of an alicyclic epoxy polymer (A) with a condensed-ring aromatic carboxylic acid and monocyclic aromatic carboxylic acid (B). The alicyclic epoxy polymer (A) may include a repeating structural unit of Formula (1): (T is a repeating unit structure containing an alicyclic ring in the polymer main chain; and E is an epoxy group or an organic group containing an epoxy group). The condensed-ring aromatic carboxylic acid and monocyclic aromatic carboxylic acid (B) may include a condensed-ring aromatic carboxylic acid (B1) and a monocyclic aromatic carboxylic acid (B2) in a molar ratio of B1:B2=3:7 to 7:3. The condensed-ring aromatic carboxylic acid (B1) may be 9-anthracenecarboxylic acid and the monocyclic aromatic carboxylic acid (B2) may be benzoic acid.
摘要（中）：

提供了具有耐热性和蚀刻选择性的抗蚀剂下层膜。 一种用于形成用于光刻的抗蚀剂下层膜的组合物，其包含脂环式环氧聚合物（A）与稠环芳族羧酸和单环芳族羧酸（B）的反应产物（C）。 脂环族环氧聚合物（A）可以包括式（1）的重复结构单元：（T是在聚合物主链中含有脂环族的重复单元结构，E是环氧基或含有环氧基的有机基 ）。 缩环芳族羧酸和单环芳香族羧酸（B）可以包括B1:B2 = 3:7〜7的摩尔比的缩环芳族羧酸（B1）和单环芳​​香族羧酸（B2） ：3。 缩环芳族羧酸（B1）可以是9-蒽代羧酸，单环芳香羧酸（B2）可以是苯甲酸。

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