发明授权
- 专利标题： Wafer's ambiance control
- 专利标题（中）： 晶圆的氛围控制
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申请号： US12435861申请日： 2009-05-05
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公开(公告)号： US08827695B2公开(公告)日： 2014-09-09
- 发明人: Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Ming-che Ho , Chien-Ling Hwang , Jui-Pin Hung
- 申请人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Ming-che Ho , Chien-Ling Hwang , Jui-Pin Hung
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： F27D15/00
- IPC分类号： F27D15/00 ; H01L21/677 ; H01L21/67
摘要：
A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.
公开/授权文献
- US20090317214A1 NOVEL WAFER'S AMBIANCE CONTROL 公开/授权日：2009-12-24