公开(公告)号：US09700950B2

公开(公告)日：2017-07-11

申请号：US13586132

申请日：2012-08-15

申请人： Bor-Ping Jang ,  Lin-Wei Wang ,  Ying-Jui Huang ,  Yi-Li Hsiao ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Bor-Ping Jang ,  Lin-Wei Wang ,  Ying-Jui Huang ,  Yi-Li Hsiao ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B23K1/20 ,  B23K3/08 ,  H05K3/38 ,  B23K1/00 ,  H05K3/34 ,  B23K101/40

CPC分类号： B23K1/0016 ,  B23K1/203 ,  B23K3/082 ,  B23K2101/40 ,  H05K3/3489

摘要： The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates.

公开(公告)号：US09021682B2

公开(公告)日：2015-05-05

申请号：US13527459

申请日：2012-06-19

申请人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： H01R43/052 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/78 ,  H01L2224/056 ,  H01L2224/1111 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/206 ,  Y10T29/49192 ,  Y10T29/49213 ,  Y10T29/514 ,  Y10T29/5177 ,  Y10T29/53217 ,  Y10T29/53235 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049 ,  H01L2224/4554

摘要： An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

摘要翻译： 一种装置包括：线圈，其被配置为供应线，被配置为在所述线中形成切口的切割装置，以及被配置为结合所述线并形成柱形凸块的毛细管。 该设备还被配置为拉动线在凹口处断裂，尾部区域附接到柱形凸块。

公开(公告)号：US08702871B2

公开(公告)日：2014-04-22

申请号：US13221673

申请日：2011-08-30

申请人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

发明人： Yi-Li Hsiao ,  Bor-Ping Jang ,  Kuei-Wei Huang ,  Lin-Wei Wang ,  Chien Ling Hwang ,  Chung-Shi Liu

IPC分类号： B08B3/00 ,  B08B5/00

CPC分类号： B08B3/12 ,  B08B3/08 ,  H01L21/67028 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/8191 ,  H01L2924/014

摘要： A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.

摘要翻译： 一种方法包括产生含有溶剂的含溶剂的蒸气。 将含溶剂的蒸气传导到包装组件以清洁包装组件。 含溶剂的蒸汽在包装组件的表面上冷凝形成液体，并从包装组件的表面流出。

公开(公告)号：US08540136B1

公开(公告)日：2013-09-24

申请号：US13605403

申请日：2012-09-06

申请人： Yeong-Jyh Lin ,  Hsin-Hung Liao ,  Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Yeong-Jyh Lin ,  Hsin-Hung Liao ,  Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： B23K31/02 ,  B21D53/36 ,  B23K20/007 ,  H01L2224/78301 ,  Y10T29/49

摘要： Methods for forming stud bumps and apparatuses for forming stud bumps are disclosed. According to an embodiment, a method includes clamping a wire with a clamp. The clamp includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method further includes bonding the wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface. The second notch is the notch pitch distance from the first notch along the wire.

摘要翻译： 公开了用于形成柱形凸块的方法和用于形成凸块凸块的装置。 根据实施例，一种方法包括用夹具夹紧线。 所述夹具包括至少两个相对的板，并且当所述线被夹紧形成所述线中的第一凹口时，所述相对板中的至少一个包括与所述线相交的突出特征。 该方法还包括将线接合到接合表面，将线从夹具中释放出来，使线穿过钳口的间距距离通过夹具夹紧线，夹具在线中形成第二凹口，并将线断开， 接合表面上的导线的接合部分。 第二个凹口是距离第一个凹口沿导线的切口间距距离。

公开(公告)号：US08276648B2

公开(公告)日：2012-10-02

申请号：US13356950

申请日：2012-01-24

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B22D11/00

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A method for forming a tube-based detector for signaling when a PVD target is reduced to a predetermined quantity of the PVD target material includes providing a mold member having an inner molding member and an outer molding member defining a space therebetween, melting a desired tube material, injecting the molten tube material into the space between the inner molding member and the outer molding member, cooling the molten tube material, removing the tube from the mold member after the molten tube material has cooled and solidified into a tube, embedding the tube in the physical vapor deposition target, wherein the tube forms an enclosure of the tube-based detector.

摘要翻译： 一种用于形成用于在PVD靶减少到预定量的PVD靶材料时进行信号传导的基于管的检测器的方法包括提供具有内部模制构件的模具构件和在其间限定空间的外部模制构件，熔化所需的管 材料，将熔融管材注入内部模制件和外部模制件之间的空间中，冷却熔融管材料，在熔融管材冷却并固化成管之后，从模具构件中取出管子，将管子 在物理气相沉积靶中，其中管形成基于管的检测器的外壳。

公开(公告)号：US20120131784A1

公开(公告)日：2012-05-31

申请号：US13356950

申请日：2012-01-24

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B23P11/00

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A method for forming a tube-based detector for signaling when a PVD target is reduced to a predetermined quantity of the PVD target material includes providing a mold member having an inner molding member and an outer molding member defining a space therebetween, melting a desired tube material, injecting the molten tube material into the space between the inner molding member and the outer molding member, cooling the molten tube material, removing the tube from the mold member after the molten tube material has cooled and solidified into a tube, embedding the tube in the physical vapor deposition target, wherein the tube forms an enclosure of the tube-based detector.

摘要翻译： 一种用于形成用于在PVD靶减少到预定量的PVD靶材料时进行信号传导的基于管的检测器的方法包括提供具有内部模制构件的模具构件和在其间限定空间的外部模制构件，熔化所需的管 材料，将熔融管材注入内部模制件和外部模制件之间的空间中，冷却熔融管材料，在熔融管材冷却并固化成管之后，从模具构件中取出管子，将管子 在物理气相沉积靶中，其中管形成基于管的检测器的外壳。

公开(公告)号：US20110126397A1

公开(公告)日：2011-06-02

申请号：US13022221

申请日：2011-02-07

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B23P11/00 ,  B29C41/42 ,  B29C41/02

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of the target structure. Each detector includes an enclosure which may be made by forming a plurality of bores in a bulk material and separating the bulk material into a plurality of discrete enclosure units each including one of the bores. Alternatively, the enclosure of the detector may be made using a mold having one or more mold members and an extrusion, casting, electrical chemical plating, and/or sheet forming method.

摘要翻译： 用于物理气相沉积的PVD靶结构。 PVD目标结构包括源材料的可消耗板和一个或多个检测器，用于指示源材料的板块何时接近或已经被减少到表示目标结构的使用寿命端点的给定量。 每个检测器包括可以通过在散装材料中形成多个孔并将散装材料分离成多个分立的包围单元而构成的外壳，每个孔包括孔中的一个。 或者，检测器的外壳可以使用具有一个或多个模具构件的模具和挤出，铸造，电化学镀和/或片材成型方法来制造。

公开(公告)号：US20110115077A1

公开(公告)日：2011-05-19

申请号：US12891487

申请日：2010-09-27

申请人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： An embodiment is a method for forming a semiconductor assembly comprising cleaning a connector comprising copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector.

摘要翻译： 一个实施例是一种用于形成半导体组件的方法，其包括清洁在基底上形成的铜的连接器，向连接器施加冷锡，向连接器施加热锡，并旋转冲洗和干燥连接器。

公开(公告)号：US07918251B2

公开(公告)日：2011-04-05

申请号：US12177598

申请日：2008-07-22

申请人： Chen-Hua Yu ,  Yi-Li Hsiao

发明人： Chen-Hua Yu ,  Yi-Li Hsiao

IPC分类号： B65B1/04

CPC分类号： H01L21/67376 ,  H01L21/67393 ,  H01L21/67772

摘要： A carrier comprises an enclosure, a cabinet and at least one substrate holder. The enclosure comprises a door. The cabinet is coupled to the carrier. The cabinet comprises at least one valve and contains at least one reduction fluid. The substrate holder is disposed within the enclosure to support at least one substrate.

摘要翻译： 载体包括外壳，机壳和至少一个基板保持器。 外壳包括一个门。 机柜耦合到载体。 所述柜包括至少一个阀并且包含至少一个还原流体。 衬底保持器设置在外壳内以支撑至少一个衬底。

公开(公告)号：US07891536B2

公开(公告)日：2011-02-22

申请号：US11427618

申请日：2006-06-29

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC分类号： B21D39/00

CPC分类号： C23C14/3407 ,  C23C14/3414 ,  H01J37/3435 ,  H01J37/3479 ,  H01J37/3482 ,  Y10T29/49826 ,  Y10T29/4998

摘要： A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of the target structure. Each detector includes an enclosure which may be made by forming a plurality of bores in a bulk material and separating the bulk material into a plurality of discrete enclosure units each including one of the bores. Alternatively, the enclosure of the detector may be made using a mold having one or more mold members and an extrusion, casting, electrical chemical plating, and/or sheet forming method.

摘要翻译： 用于物理气相沉积的PVD靶结构。 PVD目标结构包括源材料的可消耗板和一个或多个检测器，用于指示源材料的板块何时接近或已经被减少到表示目标结构的使用寿命端点的给定量。 每个检测器包括可以通过在散装材料中形成多个孔并将散装材料分离成多个分立的包围单元而构成的外壳，每个孔包括孔中的一个。 或者，检测器的外壳可以使用具有一个或多个模具构件的模具和挤出，铸造，电化学镀和/或片材成型方法来制造。