发明授权
US08828505B2 Plasma enhanced cyclic chemical vapor deposition of silicon-containing films 有权
含硅膜的等离子体增强循环化学气相沉积

Plasma enhanced cyclic chemical vapor deposition of silicon-containing films
摘要:
The present invention is a process of plasma enhanced cyclic chemical vapor deposition of silicon nitride, silicon carbonitride, silicon oxynitride, silicon carboxynitride, and carbon doped silicon oxide from alkylaminosilanes having Si—H3, preferably of the formula (R1R2N)SiH3 wherein R1 and R2 are selected independently from C2 to C10 and a nitrogen or oxygen source, preferably ammonia or oxygen has been developed to provide films with improved properties such as etching rate, hydrogen concentrations, and stress as compared to films from thermal chemical vapor deposition.
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