发明授权
US08835092B2 Resist underlayer film composition, process for forming resist underlayer film, patterning process and fullerene derivative
有权
抗蚀剂下层膜组合物,形成抗蚀剂下层膜的工艺,图案化工艺和富勒烯衍生物
- 专利标题: Resist underlayer film composition, process for forming resist underlayer film, patterning process and fullerene derivative
- 专利标题(中): 抗蚀剂下层膜组合物,形成抗蚀剂下层膜的工艺,图案化工艺和富勒烯衍生物
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申请号: US13015094申请日: 2011-01-27
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公开(公告)号: US08835092B2公开(公告)日: 2014-09-16
- 发明人: Takeru Watanabe , Takeshi Kinsho , Tsutomu Ogihara , Katsuya Takemura , Toshihiko Fujii , Daisuke Kori
- 申请人: Takeru Watanabe , Takeshi Kinsho , Tsutomu Ogihara , Katsuya Takemura , Toshihiko Fujii , Daisuke Kori
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JP2010-024379 20100205
- 主分类号: G03F7/095
- IPC分类号: G03F7/095 ; G03F7/11 ; G03F7/40 ; G03F7/09 ; C07C69/753 ; C08L61/06
摘要:
There is disclosed a resist underlayer film composition of a multilayer resist film used in lithography including (A) a fullerene derivative having a carboxyl group protected by a thermally labile group and (B) an organic solvent. There can be a resist underlayer film composition of a multilayer resist film used in lithography for forming a resist underlayer in which generation of wiggling in substrate etching can be highly suppressed and the poisoning problem in forming an upper layer pattern using a chemically amplified resist can be avoided, a process for forming the resist underlayer film, a patterning process and a fullerene derivative.
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