公开(公告)号：US08338078B2

公开(公告)日：2012-12-25

申请号：US12581625

申请日：2009-10-19

申请人： Jun Hatakeyama ,  Toshihiko Fujii ,  Takeru Watanabe ,  Youichi Ohsawa

发明人： Jun Hatakeyama ,  Toshihiko Fujii ,  Takeru Watanabe ,  Youichi Ohsawa

IPC分类号： G03F7/09 ,  G03F7/20 ,  G03F7/30 ,  G03F7/36 ,  G03C1/76

CPC分类号： G03F7/091 ,  C08G61/02 ,  C09D161/04 ,  G03F7/40

摘要： A material comprising a novolac resin having a C6-C30 aromatic hydrocarbon group substituted with a sulfo group or an amine salt thereof is useful in forming a photoresist undercoat. The undercoat-forming material has an extinction coefficient sufficient to provide an antireflective effect at a thickness of at least 200 nm, and a high etching resistance as demonstrated by slow etching rates with CF4/CHF3 gas for substrate processing.

摘要翻译： 包含具有被磺基取代的C6-C30芳族烃基的酚醛清漆树脂或其胺盐的材料可用于形成光致抗蚀剂底涂层。 底涂层材料的消光系数足以在至少200nm的厚度下提供抗反射效果，并且具有高的耐蚀刻性，如通过用于基板处理的CF 4 / CHF 3气体的缓慢蚀刻速率所证明的。

公开(公告)号：US07308999B2

公开(公告)日：2007-12-18

申请号：US10739211

申请日：2003-12-19

申请人： Toshihiko Fujii ,  Takashi Ohta ,  Shinichi Sugiura ,  Toshimasa Akamatsu ,  Katsufumi Morimune

发明人： Toshihiko Fujii ,  Takashi Ohta ,  Shinichi Sugiura ,  Toshimasa Akamatsu ,  Katsufumi Morimune

IPC分类号： B23K37/04

CPC分类号： H01L24/83 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/32 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/8319 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15763 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

摘要： A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.

摘要翻译： 一种芯片接合装置，用于在至少两个在热处理炉中加热的构件进行芯片接合的模具接合装置，包括：第一构件，其具有待焊接的表面，焊料放置在其上;以及第二构件，其以状态设置为面对第一构件 其中设置在待接合的第一构件的表面上的焊料插入其间，并且用于将第一构件安装在预定位置的基部，其中基部具有使得附近的温度的温度分布 在热处理炉中进行加热的状态下，在基部的预定方向上的中心部分的高度大于基部的端部附近的中心部分，从而可以抑制 在焊料中发生气泡。

公开(公告)号：US5739970A

公开(公告)日：1998-04-14

申请号：US503200

申请日：1995-07-17

申请人： Masayoshi Kobayashi ,  Keisuke Hoshino ,  Masaru Ohshita ,  Akira Takano ,  Makoto Sasaki ,  Makoto Matsuda ,  Toshihiko Fujii

发明人： Masayoshi Kobayashi ,  Keisuke Hoshino ,  Masaru Ohshita ,  Akira Takano ,  Makoto Sasaki ,  Makoto Matsuda ,  Toshihiko Fujii

IPC分类号： G11B15/20 ,  G11B15/48 ,  G11B15/62 ,  G11B15/67 ,  G11B33/14 ,  G11B15/18 ,  G11B15/43

CPC分类号： G11B15/48 ,  G11B15/20 ,  G11B15/62 ,  G11B15/67 ,  G11B33/144

摘要： Disclosed herein is a magnetic tape unit having a magnetic head for reading and writing data from and onto a magnetic tape. The magnetic tape is traveled in contact with the magnetic head during a read/write operation of the magnetic head. During a rest period where the read/write operation of the magnetic head is not performed, a reciprocating motion of the magnetic tape by a small distance is performed with a predetermined period. A temperature in the vicinity of the magnetic head is detected by a temperature sensor. The predetermined period is changed according to the temperature detected by the temperature sensor. Accordingly, the adhesion of the magnetic tape to the magnetic head can be well prevented irrespective of the temperature inside the tape unit.

公开(公告)号：US4242172A

公开(公告)日：1980-12-30

申请号：US941741

申请日：1978-09-12

申请人： Toshihiko Fujii

发明人： Toshihiko Fujii

IPC分类号： B31F1/00 ,  B32B3/28 ,  B60R13/02 ,  B32B31/00

CPC分类号： B32B3/28 ,  B31F1/0077 ,  B60R13/0225 ,  Y10T156/1048 ,  Y10T156/1749 ,  Y10T156/1761

摘要： In a method of press-forming a planer board of corrugated paperboard into a curved board which serves as the substrate of, for example, an automobile roof trim board by utilizing a thermoplastic adhesive in the production of the corrugated paperboard and applying heat to the planer board through dies in a hot-press, the liners of the corrugated paperboard are prevented from wrinkling by preheating the planer board so as to soften the thermoplastic adhesive therein immediately before placement between the dies. An apparatus to perform this method comprises a board carrier which has heaters and can carry the planer board into the hot-press with continued heating of the board.

摘要翻译： 在将瓦楞纸板的平面板压制成弯曲板的方法中，所述弯曲板用作例如汽车车顶装饰板的基板，在制造瓦楞纸板中使用热塑性粘合剂并向刨床施加热量 通过热压机中的模具板，通过预热刨床来防止瓦楞纸板的衬垫起皱，以便在放置在模具之前立即软化其中的热塑性粘合剂。 执行该方法的装置包括具有加热器的板载体，并且可以在板的持续加热的情况下将刨床携带到热压机中。

公开(公告)号：US4143587A

公开(公告)日：1979-03-13

申请号：US817434

申请日：1977-07-20

申请人： Toshihiko Fujii

发明人： Toshihiko Fujii

IPC分类号： B30B9/00 ,  B29C33/00 ,  B29C43/00 ,  B29C43/02 ,  B29C43/32 ,  B29C43/36 ,  B29C43/58 ,  B29C51/00 ,  B29C51/26 ,  B31F1/00 ,  B32B3/28 ,  E04C2/32 ,  B30B15/34 ,  B31B43/00

CPC分类号： B29C51/262 ,  B29C51/006 ,  B31F1/00 ,  B32B3/28 ,  E04C2/328 ,  B29C43/203 ,  B29K2995/0002 ,  Y10S425/11

摘要： Apparatus for inelastically deforming an initially flat blank of a corrugated fiberboard, comprising two die blocks movable relative to each other and having complementarily convex and concave pressing surfaces and blank retaining means adapted to clamp opposite marginal portions of a blank of a corrugated fiberboard being warped between the die blocks with the marginal portions urged sidewise inboardly of the die blocks, the blank retaining means being operative to restrain the blank from being moved in a direction parallel with the marginal portions but to allow the marginal portion of the blank to move the marginal portions of the blank sidewise inboardly of the die blocks in a direction perpendicular to the marginal portions so that not only production of creases in curved portions of the blank but production of fissures as would be caused if the blank is excessively stretched between the opposite marginal portions of the blank are precluded.

摘要翻译： 用于使瓦楞纤维板的初始平坦的坯料非弹性变形的装置，包括两个可相对于彼此移动并具有互补的凸形和凹形的压制表面的模块，以及用于夹紧瓦楞纸板的坯料的相对的边缘部分的坯料保持装置， 具有边缘部分的模块被侧向地推压在模具块的内侧，坯料保持装置可操作地限制坯料沿平行于边缘部分的方向移动，但是允许坯料的边缘部分移动边缘部分 在坯料侧面沿垂直于边缘部分的方向的坯料侧面的坯料，使得不仅在坯料的弯曲部分中产生折痕，而且如果坯料在相对的边缘部分之间过度拉伸，则会产生裂缝 空白被排除。

公开(公告)号：US4119451A

公开(公告)日：1978-10-10

申请号：US816275

申请日：1977-07-15

申请人： Toshihiko Fujii

发明人： Toshihiko Fujii

IPC分类号： B32B37/00 ,  B26D7/08 ,  B29C51/08 ,  B29C51/16 ,  B29C51/32 ,  B29C61/00 ,  B29C67/00 ,  B29C69/00 ,  B29D16/00 ,  B31F1/00 ,  B60R13/02 ,  B32B31/20 ,  B32B31/18

CPC分类号： B29C67/0011 ,  B26D7/084 ,  B29C51/082 ,  B29C51/16 ,  B29C51/32 ,  B31F1/0077 ,  B60R13/02 ,  B29C2793/0081 ,  B29L2024/003 ,  B29L2031/3005 ,  Y10T156/1026 ,  Y10T156/1041 ,  Y10T156/1057

摘要： In the production of a trim board such as an automobile roof trim board using a corrugated paperboard substrate which is bulged or dented in a comparatively small area and has an aperture in this area for the installation of a separate article, at least one linear notch is formed in a flat board of corrugated paperboard so as to extend transversal to the ridges of the corrugated medium and be entirely included in the area of the aperture as a preparatory procedure to press-forming of the corrugated paperboard. The presence of the notch allows some deformation of a tensioned liner also in the same direction as the ridges and hence precludes the appearance of cracks in the bulged or dented area. The notched region of the shaped board is thoroughly cut away as the result of the formation of the intended aperture.

摘要翻译： 在使用瓦楞纸板基板的装饰板的制造中，所述瓦楞纸板基板在相对小的区域中被凸出或凹陷并且在该区域中具有用于安装单独制品的孔，至少一个线性凹口是 形成在瓦楞纸板的平板中，以横向延伸到波纹状介质的脊部，并且作为用于压制成形瓦楞纸板的准备程序被完全包括在孔的区域中。 凹口的存在允许张力衬套也与脊相同的方向发生一些变形，因此排除了在凸出或凹陷区域中的裂纹的出现。 由于形成所需的孔径，成形板的切口区域被彻底切除。

公开(公告)号：US09076738B2

公开(公告)日：2015-07-07

申请号：US13183175

申请日：2011-07-14

申请人： Takeru Watanabe ,  Toshihiko Fujii ,  Takeshi Kinsho ,  Tsutomu Ogihara

发明人： Takeru Watanabe ,  Toshihiko Fujii ,  Takeshi Kinsho ,  Tsutomu Ogihara

IPC分类号： H01L21/311 ,  C07C69/753 ,  G03F7/11 ,  H01L21/027

CPC分类号： H01L21/31144 ,  C07C69/753 ,  C07C2604/00 ,  G03F7/11 ,  H01L21/0271 ,  H01L21/31116

摘要： The invention provides a composition for a resist underlayer film, the composition for a resist underlayer film to form a resist underlayer film of a multilayer resist film used in lithography, wherein the composition comprises at least (A) a fullerene derivative that is a reaction product of a substance having a fullerene skeleton with a 1,3-diene compound derivative having an electron-withdrawing group and (B) an organic solvent. There can be a composition for a resist underlayer film for a multilayer resist film used in lithography, the composition giving a resist underlayer film having excellent high dry etching resistance, capable of suppressing wiggling during substrate etching with high effectiveness, and capable of avoiding a poisoning problem in upperlayer patterning that uses a chemical amplification resist; a process for forming a resist underlayer film; a patterning process; and a fullerene derivative.

摘要翻译： 本发明提供了一种用于抗蚀剂下层膜的组合物，用于形成抗蚀剂下层膜的组合物，用于形成用于光刻的多层抗蚀剂膜的抗蚀剂下层膜，其中所述组合物至少包含（A）富勒烯衍生物，其为反应产物 具有富勒烯骨架的物质与具有吸电子基团的1,3-二烯化合物衍生物和（B）有机溶剂。 可以使用用于光刻中的多层抗蚀剂膜的抗蚀剂下层膜的组合物，该组合物赋予抗蚀剂下层膜，其具有优异的耐干蚀刻性，能够高效地抑制基板蚀刻期间的扭曲，并且能够避免中毒 使用化学增幅抗蚀剂的上层图案化问题; 形成抗蚀剂下层膜的工序; 图案化过程; 和富勒烯衍生物。

公开(公告)号：US08663898B2

公开(公告)日：2014-03-04

申请号：US13311137

申请日：2011-12-05

申请人： Tsutomu Ogihara ,  Takeru Watanabe ,  Yusuke Biyajima ,  Daisuke Kori ,  Takeshi Kinsho ,  Toshihiko Fujii

发明人： Tsutomu Ogihara ,  Takeru Watanabe ,  Yusuke Biyajima ,  Daisuke Kori ,  Takeshi Kinsho ,  Toshihiko Fujii

IPC分类号： G03F7/00 ,  G03F7/11 ,  G03F7/26 ,  G03F7/40

CPC分类号： G03F7/091 ,  G03F7/094

摘要： There is disclosed A resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), one or more kinds of a compound represented by the following general formula (2), and one or more kinds of a compound, represented by the following general formula (3), and/or an equivalent body thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.

摘要翻译： 公开了抗蚀剂下层膜组合物，其中组合物含有通过至少一种或多种下列通式（1-1）和/或（1-2）表示的化合物的缩合得到的聚合物：一种或多种 由以下通式（2）表示的化合物的种类以及由以下通式（3）表示的化合物和/或其等同体的一种或多种。 可以提供能够形成具有降低的反射率的下层膜（即，具有最佳n值和k值作为抗反射膜的下层膜）的三层抗蚀剂工艺的下层膜组合物， 特别是在60nm以上的高方位线上，特别是在蚀刻后，不会引起线下落或翘曲，以及使用其的图案化处理。

公开(公告)号：US08592956B2

公开(公告)日：2013-11-26

申请号：US13292696

申请日：2011-11-09

申请人： Tsutomu Ogihara ,  Daisuke Kori ,  Yusuke Biyajima ,  Takeru Watanabe ,  Toshihiko Fujii ,  Takeshi Kinsho

发明人： Tsutomu Ogihara ,  Daisuke Kori ,  Yusuke Biyajima ,  Takeru Watanabe ,  Toshihiko Fujii ,  Takeshi Kinsho

IPC分类号： H01L23/58 ,  H01L21/469

CPC分类号： G03F7/11 ,  G03F7/091 ,  G03F7/095

摘要： There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formula (1-1) and/or general formula (1-2), and one or more kinds of compounds and/or equivalent bodies thereof represented by the following general formula (2). There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.

摘要翻译： 公开了一种抗蚀剂下层膜组合物，其中组合物含有通过至少一种或多种下列通式（1-1）和/或通式（1-2）表示的化合物的缩合得到的聚合物，和 一种或多种由以下通式（2）表示的化合物和/或其等同体。 可以提供能够形成具有降低的反射率的下层膜（即，具有最佳n值和k值的下层膜）的三层抗蚀剂工艺的下层膜组合物，优异的填充性，高 图案抗菌性，特别是在薄于60nm的高纵横线上，特别是在蚀刻后不会引起线下落或摆动，以及使用其的图案化处理。

公开(公告)号：US08450048B2

公开(公告)日：2013-05-28

申请号：US12585387

申请日：2009-09-14

申请人： Jun Hatakeyama ,  Toshihiko Fujii ,  Tsutomu Ogihara

发明人： Jun Hatakeyama ,  Toshihiko Fujii ,  Tsutomu Ogihara

IPC分类号： G03F7/40 ,  G03F7/11

CPC分类号： G03F7/091 ,  G03F7/095

摘要： There is disclosed a method for forming a resist underlayer film of a multilayer resist film having at least three layers used in a lithography, comprising at least; a step of coating a composition for resist underlayer film containing a novolak resin represented by the following general formula (1) obtained by treating a compound having a bisnaphthol group on a substrate; and a step of curing the coated composition for the resist underlayer film by a heat treatment at a temperature above 300° C. and 600° C. or lower for 10 to 600 seconds. There can be provided a method for forming a resist underlayer film, and a patterning process using the method to form a resist underlayer film in a multilayer resist film having at least three layers used in a lithography, gives a resist underlayer film having a lowered reflectance, a high etching resistance, and a high heat and solvent resistances, especially without wiggling during substrate etching.

摘要翻译： 公开了一种形成多层抗蚀剂膜的抗蚀剂下层膜的方法，所述多层抗蚀剂膜具有至少三层，其至​​少包括： 涂布含有下述通式（1）表示的酚醛清漆树脂的抗蚀剂下层膜用组合物的工序，所述酚醛清漆树脂通过在基材上处理具有双萘酚基的化合物而得到; 以及通过在高于300℃和600℃或更低的温度下热处理10至600秒来固化抗蚀剂下层膜的涂覆组合物的步骤。 可以提供一种形成抗蚀剂下层膜的方法，并且使用在具有至少三层的平版印刷用的多层抗蚀剂膜中形成抗蚀剂下层膜的方法的图案化工艺，得到具有降低的反射率的抗蚀剂下层膜 ，耐腐蚀性高，耐热和耐溶剂性高，特别是在基板蚀刻期间无晃动。