发明授权
US08847333B2 Techniques providing metal gate devices with multiple barrier layers
有权
提供具有多个阻挡层的金属栅极器件的技术
- 专利标题: Techniques providing metal gate devices with multiple barrier layers
- 专利标题(中): 提供具有多个阻挡层的金属栅极器件的技术
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申请号: US13224033申请日: 2011-09-01
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公开(公告)号: US08847333B2公开(公告)日: 2014-09-30
- 发明人: Xiong-Fei Yu , Chun-Yuan Chou , Da-Yuan Lee , Kuang-Yuan Hsu , Jeff J. Xu
- 申请人: Xiong-Fei Yu , Chun-Yuan Chou , Da-Yuan Lee , Kuang-Yuan Hsu , Jeff J. Xu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L29/51 ; H01L21/28 ; H01L21/8238 ; H01L29/49 ; H01L29/66 ; H01L29/165 ; H01L29/78
摘要:
A semiconductor device with a metal gate is disclosed. An exemplary semiconductor device with a metal gate includes a semiconductor substrate, source and drain features on the semiconductor substrate, a gate stack over the semiconductor substrate and disposed between the source and drain features. The gate stack includes a HK dielectric layer formed over the semiconductor substrate, a plurality of barrier layers of a metal compound formed on top of the HK dielectric layer, wherein each of the barrier layers has a different chemical composition; and a stack of metals gate layers deposited over the plurality of barrier layers.
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