Invention Grant
US08853312B2 Resin composition and semiconductor device produced by using the same 有权
树脂组合物和使用其制备的半导体器件

Resin composition and semiconductor device produced by using the same
Abstract:
A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
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