Invention Grant
US08853312B2 Resin composition and semiconductor device produced by using the same
有权
树脂组合物和使用其制备的半导体器件
- Patent Title: Resin composition and semiconductor device produced by using the same
- Patent Title (中): 树脂组合物和使用其制备的半导体器件
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Application No.: US13717009Application Date: 2012-12-17
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Publication No.: US08853312B2Publication Date: 2014-10-07
- Inventor: Hikaru Okubo , Nobuki Tanaka , Itaru Watanabe
- Applicant: Sumitomo Bakelite Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd
- Current Assignee: Sumitomo Bakelite Co., Ltd
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell LLP
- Priority: JP2004-080921 20040319; JP2004-083936 20040323; JP2004-085885 20040324; JP2004-371083 20041222; JP2004-377430 20041227
- Main IPC: C08K3/08
- IPC: C08K3/08 ; C08L79/08 ; H01L23/00 ; C09J179/08 ; C09J201/02 ; C08G73/12 ; C08F220/58 ; C08K5/14 ; C08K5/00 ; C08K3/26 ; C08F234/02

Abstract:
A quick curing resin composition, which can be used in conventionally used ovens, and a semiconductor device, which is excellent in reliability such as solder crack resistance or the like when the resin composition, is used as a die attach material for semiconductor. The resin composition has a sufficient low stress property, good adhesion and excellent bleeding property. The resin composition includes a filler (A), compound (B) having the structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.
Public/Granted literature
- US20130109798A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME Public/Granted day:2013-05-02
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