Invention Grant
- Patent Title: Micro-needle arrays having non-planar tips and methods of manufacture thereof
- Patent Title (中): 具有非平面尖端的微针阵列及其制造方法
-
Application No.: US11807766Application Date: 2007-05-29
-
Publication No.: US08865288B2Publication Date: 2014-10-21
- Inventor: Rajmohan Bhandari , Sandeep Negi , Florian Solzbacher , Richard A. Normann
- Applicant: Rajmohan Bhandari , Sandeep Negi , Florian Solzbacher , Richard A. Normann
- Applicant Address: US UT Salt Lake City
- Assignee: University of Utah Research Foundation
- Current Assignee: University of Utah Research Foundation
- Current Assignee Address: US UT Salt Lake City
- Agency: Thorpe North & Western LLP
- Main IPC: B32B3/30
- IPC: B32B3/30 ; B44C1/22 ; A61B5/04 ; H01L21/77 ; H01L29/08 ; A61M37/00
Abstract:
A micro-needle array having tips disposed along a non-planar surface is formed by shaping the wafer surface into a non-planar surface to define the tips of the micro-needles. A plurality of trenches are cut into the wafer to form a plurality of columns having tops corresponding to the non-planar surface. The columns are rounded and sharpened by etching to form the micro-needles.
Public/Granted literature
- US20080138583A1 Micro-needle arrays having non-planar tips and methods of manufacture thereof Public/Granted day:2008-06-12
Information query
