摘要:
A method for fabricating a photoelectric array device with an optical micro lens array (10) using a plurality of photovoltaic dies (12) so a lens (14) is aligned to each die (12) in the array device. A back surface (16) of a lens array substrate (10) is metallized with electrical conducting lines and interconnects (18). Fabricated photovoltaic dies are aligned to an alignment substrate using a fluidic capillary-driven alignment process. The plurality of aligned dies (12) is attached mechanically and electrically to the metallized lens array substrate (10), so the each die (12) aligns with a lens (14) in the lens array substrate (10). The alignment substrate is removed from the dies (12) attached to the lens array substrate (10). A back panel substrate (22) is coupled mechanically and electrically to the plurality of dies (12) attached to the lens array substrate (10).
摘要:
Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wetable layer, and a wetting stop layer. Various thicknesses and materials for use in the different layers are disclosed and are particularly useful for metallization in implantable electronic devices such as neural electrode arrays.
摘要:
Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wettable layer, and a wetting stop layer. Various thicknesses and materials for use in the different layers are disclosed and are particularly useful for metallization in implantable electronic devices such as neural electrode arrays.
摘要:
A method of fabricating an array of micro electrodes enabled to have customizable lengths. A substantially criss-cross pattern of channels on a top surface of the work-piece substrate (10) is formed using electrical discharge machining to form a plurality of shaped columns (20) having tapered profiles. The shaped columns have a tapering profile which extends at least 50% of the length of the columns. The plurality of shaped columns is etched to sharpen the tapered tips into needle tips forming the array of microelectrodes.
摘要:
Methods for wafer-scale fabrication of needle arrays can include mechanically modifying a wafer to produce a plurality of vertically-extending columns. The columns are etched to round and reshape the columns into substantially uniformly shaped needles. Needle arrays having needle width non-uniformity of less than about 3% and length non-uniformity of less than about 2% can be produced.
摘要:
The present invention provides microelectrode array stabilizing devices and associated methods. A microelectrode array stabilizing device includes a first microelectrode array substrate having a plurality of first microelectrodes configured to penetrate tissue. A plurality of first interlocking structures are coupled to the first microelectrode array substrate, with each of the plurality of first interlocking structures including a first interlocking mechanism at a distal end. The device may further include a second microelectrode array substrate which optionally has a plurality of second microelectrodes configured to penetrate tissue. A plurality of second interlocking structures are coupled to the second microelectrode array substrate, each of the plurality of second interlocking structures including a second interlocking mechanism at a distal end. The second interlocking mechanism is complimentary to the first interlocking mechanism. The first microelectrode array and the second microelectrode array are configured to self-align and couple together with the first interlocking mechanism secured to the second interlocking mechanism.
摘要:
A method of fabricating a sub-millimeter scale curved surface on a substrate (10) includes cutting a plurality of trenches (12) of varying depth into the substrate (10). The depth of the trenches (12) corresponds to a desired surface profile. The substrate (10) is etched to remove material left (16) between the trenches to form the curved surface.
摘要:
A method of forming a sensor with an embedded cavity can include forming at least one cavity (50) in a substrate (52). The cavity (50) can include at least one membrane wall (54) having a plurality of holes (64) in the membrane wall (54), the plurality of holes (64) being formed in a two-dimensional array. A piezoresistive system (58) can be mechanically associated with the membrane wall (54). The method can be a front-side or back-side process for forming the cavity (50). The membrane (54) simultaneously acts as a diaphragm and a fluid passage into the cavity (50). Such sensors can be suitable as pressure sensors, chemical sensors, flow sensors and the like.
摘要:
Methods for wafer-scale fabrication of needle arrays can include mechanically modifying a wafer to produce a plurality of vertically-extending columns. The columns are etched to round and reshape the columns into substantially uniformly shaped needles. Needle arrays having needle width non-uniformity of less than about 3% and length non-uniformity of less than about 2% can be produced.
摘要:
A method of fabricating a sub-millimeter scale curved surface on a substrate (10) includes cutting a plurality of trenches (12) of varying depth into the substrate (10). The depth of the trenches (12) corresponds to a desired surface profile. The substrate (10) is etched to remove material left (16) between the trenches to form the curved surface.