发明授权
- 专利标题： Enhanced interconnect link width modulation for power savings
- 专利标题（中）： 增强的互连链路宽度调制功率节省
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申请号： US13175794申请日： 2011-07-01
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公开(公告)号： US08868955B2公开(公告)日： 2014-10-21
- 发明人: Venkatraman Iyer , Robert G. Blankenship , Dennis R. Halicki
- 申请人： Venkatraman Iyer , Robert G. Blankenship , Dennis R. Halicki
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Caven & Aghevli LLC
- 主分类号： G06F1/32
- IPC分类号： G06F1/32
摘要：
Methods and apparatus relating to enhanced interconnect link width modulation for power savings are described. In one embodiment, the width of a link is modified from a first width to a second width in response to a power management flit, while non-idle flits continue to be transmitted over the link after transmission of the power management flit. Other embodiments are also disclosed and claimed.
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