发明授权
- 专利标题: Wiring substrate and method of manufacturing the same
- 专利标题(中): 接线基板及其制造方法
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申请号: US13279501申请日: 2011-10-24
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公开(公告)号: US08878077B2公开(公告)日: 2014-11-04
- 发明人: Takashi Ito , Tomoo Yamasaki , Yuta Sakaguchi
- 申请人: Takashi Ito , Tomoo Yamasaki , Yuta Sakaguchi
- 申请人地址: JP Nagano-shi
- 专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人: Shinko Electric Industries Co., Ltd.
- 当前专利权人地址: JP Nagano-shi
- 代理机构: Kratz, Quintos & Hanson, LLP
- 优先权: JP2010-241744 20101028
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K1/09 ; H05K3/46 ; H05K3/22 ; H05K3/10 ; H01L21/48
摘要:
A method of manufacturing a wiring substrate, includes forming a laminated body in which a nickel copper alloy layer is formed via an insulating resin layer, on a first wiring layer, forming a via hole reaching the first wiring layer in the nickel copper alloy layer and the insulating resin layer, applying a desmear process to an inside of the via hole, forming a seed layer on the nickel copper alloy layer and an inner surface of the via hole, forming a plating resist in which an opening portion is provided on a part containing the via hole, forming a metal plating layer in the opening portion in the plating resist by an electroplating, removing the plating resist, and forming a second wiring layer by etching the seed layer and the nickel copper alloy layer while using the metal plating layer as a mask.
公开/授权文献
- US20120103667A1 WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 公开/授权日:2012-05-03