Invention Grant
- Patent Title: Method of manufacturing light emitting device
- Patent Title (中): 制造发光器件的方法
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Application No.: US13789677Application Date: 2013-03-08
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Publication No.: US08889459B2Publication Date: 2014-11-18
- Inventor: Mototaka Inobe , Motokazu Yamada , Kazuhiro Kamada
- Applicant: Nichia Corporation
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2009-019412 20090130; JP2009-268587 20091126
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/52 ; H01L33/54 ; H01L25/075 ; H01L33/60

Abstract:
In method of manufacturing a light emitting device, a substrate is provided, and metallization is established on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. The surfaces of metallization and at least side surface of the light emitting element are continuously covered with insulating material. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element.
Public/Granted literature
- US20130183787A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2013-07-18
Information query
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