Invention Grant
- Patent Title: Gas enclosure assembly and system
- Patent Title (中): 气体罩组件和系统
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Application No.: US13720830Application Date: 2012-12-19
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Publication No.: US08899171B2Publication Date: 2014-12-02
- Inventor: Justin Mauck , Alexander Sou-Kang Ko , Eliyahu Vronsky , Shandon Alderson
- Applicant: Kateeva, Inc.
- Applicant Address: US CA Menlo Park
- Assignee: Kateeva, Inc.
- Current Assignee: Kateeva, Inc.
- Current Assignee Address: US CA Menlo Park
- Main IPC: B05B7/00
- IPC: B05B7/00 ; C23C14/00 ; B05D5/06 ; F24F3/16 ; B41J29/393 ; H05B33/10 ; H01L51/00 ; H01L51/56

Abstract:
The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
Public/Granted literature
- US20130252533A1 Gas Enclosure Assembly and System Public/Granted day:2013-09-26
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