Invention Grant
- Patent Title: Method of filling porosity of ceramic component
- Patent Title (中): 填充陶瓷部件孔隙度的方法
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Application No.: US13251644Application Date: 2011-10-03
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Publication No.: US08900661B2Publication Date: 2014-12-02
- Inventor: Wayde R. Schmidt , David C. Jarmon , William K. Tredway
- Applicant: Wayde R. Schmidt , David C. Jarmon , William K. Tredway
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: C04B35/00
- IPC: C04B35/00 ; C04B35/52 ; C04B35/10 ; C04B35/58 ; C04B35/584 ; C04B35/565 ; B05D1/36 ; B05D7/22 ; C04B41/00 ; C04B35/82 ; C04B35/628 ; C04B35/14 ; C04B41/85 ; C04B41/50

Abstract:
A method of fabricating a ceramic component includes initially partially filling pores of a porous structure using one of a first processing technique or a second, different processing technique to form a preform body with residual porosity. The first processing technique produces a first ceramic material in the pores of the porous structure and a second processing technique produces a second ceramic material in the pores of the porous structure. When the first processing technique is used to initially partially fill the pores of the porous structure, the second processing technique is used thereafter to at least partially fill the residual porosity with the second ceramic material. When the second processing technique is used to initially partially fill the pores, the first processing technique is used thereafter to at least partially fill the residual porosity.
Public/Granted literature
- US20130085057A1 METHOD AND CERAMIC COMPONENT Public/Granted day:2013-04-04
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