发明授权
US08901667B2 High performance non-planar semiconductor devices with metal filled inter-fin gaps
有权
具有金属填充的间隙间隙的高性能非平面半导体器件
- 专利标题: High performance non-planar semiconductor devices with metal filled inter-fin gaps
- 专利标题(中): 具有金属填充的间隙间隙的高性能非平面半导体器件
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申请号: US14073366申请日: 2013-11-06
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公开(公告)号: US08901667B2公开(公告)日: 2014-12-02
- 发明人: Hemanth Jagannathan , Sivananda Kanakasabapathy
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: F. Chau & Associates, LLC
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L29/78 ; H01L27/092
摘要:
A non-planar semiconductor transistor device includes a substrate layer. Conductive channels extend between corresponding source and drain electrodes. A gate stack extending in a direction perpendicular to the conductive channels crosses over the plurality of conductive channels. The gate stack includes a dielectric layer running along the substrate and the plurality of conductive channels and arranged with a substantially uniform layer thickness, a work-function electrode layer covers the dielectric layer and is arranged with a substantially uniform layer thickness, and a metal layer, distinct from the work-function electrode layer, covers the work-function electrode layer and is arranged with a substantially uniform height with respect to the substrate such that the metal layer fills a gap between proximate conductive channels of the plurality of conductive channels.
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