发明授权
- 专利标题： Substrate processing apparatus
- 专利标题（中）： 基板加工装置
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申请号： US12389431申请日： 2009-02-20
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公开(公告)号： US08904955B2公开(公告)日： 2014-12-09
- 发明人: Makoto Nomura , Yukio Ozaki , Reizo Nunozawa , Satoru Takahata
- 申请人： Makoto Nomura , Yukio Ozaki , Reizo Nunozawa , Satoru Takahata
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Kokusai Electric, Inc.
- 当前专利权人： Hitachi Kokusai Electric, Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Brundidge & Stanger, P.C.
- 优先权： JP2008-044220 20080226
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; H01L21/67
摘要：
A substrate processing apparatus includes a control unit executing a first recipe for substrate processing. After the substrate processing is completed through the execution of the first recipe, if a predetermined time is elapsed in a state that a next substrate to be processed is not carried into the process chamber, a second recipe is executed for maintaining a process chamber where the substrate is processed.
公开/授权文献
- US20090229634A1 SUBSTRATE PROCESSING APPARATUS 公开/授权日：2009-09-17