Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13872914Application Date: 2013-04-29
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Publication No.: US08907349B2Publication Date: 2014-12-09
- Inventor: Yuji Ando , Kazuki Ota
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Foley & Lardner LLP
- Priority: JP2012-105363 20120502
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/778 ; H01L29/205 ; H01L29/43 ; H01L29/66 ; H01L29/10 ; H01L29/20

Abstract:
In a high electron mobility transistor, with a normally-off operation maintained, on-resistance can be sufficiently reduced, so that the performance of a semiconductor device including the high electron mobility transistor is improved. Between a channel layer and an electron supply layer, a spacer layer whose band gap is larger than the band gap of the electron supply layer is provided. Thereby, due to the fact that the band gap of the spacer layer is large, a high potential barrier (electron barrier) is formed in the vicinity of an interface between the channel and the electron supply layer.
Public/Granted literature
- US20130292690A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-11-07
Information query
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