Invention Grant
- Patent Title: Methods and apparatus for thermal based substrate processing with variable temperature capability
- Patent Title (中): 具有可变温度能力的基于热处理基板的方法和装置
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Application No.: US13169373Application Date: 2011-06-27
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Publication No.: US08920564B2Publication Date: 2014-12-30
- Inventor: Gwo-Chuan Tzu , Xiaoxiong Yuan , Amit Khandelwal , Benjamin Cheng Wang , Avgerinos V. Gelatos , Kai Wu , Michael P. Karazim , Jing Lin , Olkan Cuvalci
- Applicant: Gwo-Chuan Tzu , Xiaoxiong Yuan , Amit Khandelwal , Benjamin Cheng Wang , Avgerinos V. Gelatos , Kai Wu , Michael P. Karazim , Jing Lin , Olkan Cuvalci
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/44 ; C23C16/455 ; C23C16/52 ; C23C16/458 ; C23C16/46

Abstract:
A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap.
Public/Granted literature
- US20120003388A1 METHODS AND APPARATUS FOR THERMAL BASED SUBSTRATE PROCESSING WITH VARIABLE TEMPERATURE CAPABILITY Public/Granted day:2012-01-05
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