Invention Grant
- Patent Title: Semiconductor device and a method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13839870Application Date: 2013-03-15
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Publication No.: US08921940B2Publication Date: 2014-12-30
- Inventor: Jin-Bum Kim , Suk-Hun Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: F. Chau & Associates, LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L27/12 ; H01L21/76

Abstract:
To fabricate a semiconductor device, a fin is formed to protrude from a substrate. The fin is extended in a first direction. A gate line is formed on the fin and the substrate. The gate line is extended in a second direction crossing the first direction. An amorphous material layer is conformally formed to cover the substrate, the fin, and the gate line. The amorphous material layer is partially removed, thereby forming a first remaining amorphous layer on side walls of the fin and a second remaining amorphous layer on side walls of the gate line. The first remaining amorphous layer and the second remaining amorphous layer are annealed and the first remaining amorphous material layer and the second remaining amorphous material layer are crystallized into a monocrystalline material layer and a polycrystalline material layer, respectively. The polycrystalline material layer is removed.
Public/Granted literature
- US20140264597A1 SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME Public/Granted day:2014-09-18
Information query
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