Invention Grant
US08927748B2 Alkyl-substituted allyl carbonyl metal complexes and use thereof for preparing dielectric thin films
有权
烷基取代的烯丙基羰基金属络合物及其用于制备电介质薄膜的用途
- Patent Title: Alkyl-substituted allyl carbonyl metal complexes and use thereof for preparing dielectric thin films
- Patent Title (中): 烷基取代的烯丙基羰基金属络合物及其用于制备电介质薄膜的用途
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Application No.: US13569906Application Date: 2012-08-08
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Publication No.: US08927748B2Publication Date: 2015-01-06
- Inventor: Rajesh Odedra , Neil Boag , Jeff Anthis , Ravi Kanjolia , Mark Saly
- Applicant: Rajesh Odedra , Neil Boag , Jeff Anthis , Ravi Kanjolia , Mark Saly
- Applicant Address: US MO St. Louis
- Assignee: Sigma-Aldrich Co. LLC
- Current Assignee: Sigma-Aldrich Co. LLC
- Current Assignee Address: US MO St. Louis
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: C07F13/00
- IPC: C07F13/00 ; C23C16/00 ; C23C16/18 ; C23C16/40 ; C23C16/455 ; H01L21/02 ; H01L21/285 ; H01L21/768
Abstract:
Organometallic complexes and use thereof in thin film deposition, such as CVD and ALD are provided herein. The organometallic complexes are (alkyl-substituted η3-allyl)(carbonyl)metal complexes.
Public/Granted literature
- US20130041170A1 ALKYL-SUBSTITUTED ALLYL CARBONYL METAL COMPLEXES AND USE THEREOF FOR PREPARING DIELECTRIC THIN FILMS Public/Granted day:2013-02-14
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