发明授权
- 专利标题： Solder alloy
- 专利标题（中）： 焊锡合金
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申请号： US13261681申请日： 2012-04-09
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公开(公告)号： US08932519B2公开(公告)日： 2015-01-13
- 发明人: Seiko Ishibashi , Shunsaku Yoshikawa , Tsukasa Ohnishi
- 申请人： Seiko Ishibashi , Shunsaku Yoshikawa , Tsukasa Ohnishi
- 申请人地址： JP Tokyo
- 专利权人： Senju Metal Industry Co., Ltd.
- 当前专利权人： Senju Metal Industry Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理商 Michael Tobias
- 国际申请： PCT/JP2012/059668 WO 20120409
- 国际公布： WO2013/153595 WO 20131017
- 主分类号： C22C13/00
- IPC分类号： C22C13/00 ; B23K35/26 ; B23K35/02 ; B23K1/00 ; B23K1/008 ; B23K1/20 ; H05K3/34
摘要：
A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%.
公开/授权文献
- US20130343809A1 SOLDER ALLOY 公开/授权日：2013-12-26
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