Invention Grant
- Patent Title: Thin film transistor memory and its fabricating method
- Patent Title (中): 薄膜晶体管存储器及其制造方法
-
Application No.: US13812070Application Date: 2012-04-24
-
Publication No.: US08932929B2Publication Date: 2015-01-13
- Inventor: Shijin Ding , Sun Chen , Xingmei Cui , Pengfei Wang , Wei Zhang
- Applicant: Shijin Ding , Sun Chen , Xingmei Cui , Pengfei Wang , Wei Zhang
- Applicant Address: CN Shanghai
- Assignee: Fudan University
- Current Assignee: Fudan University
- Current Assignee Address: CN Shanghai
- Agency: Banner & Witcoff, Ltd.
- Priority: CN20121012964 20120410
- International Application: PCT/CN2012/000549 WO 20120424
- International Announcement: WO2013/152458 WO 20131017
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L29/66 ; H01L29/788

Abstract:
The invention relates to a thin film transistor memory and its fabricating method. This memory using the substrate as the gate electrode from bottom to up includes a charge blocking layer, a charge storage layer, a charge tunneling layer, an active region of the device and source/drain electrodes. The charge blocking layer is the ALD grown Al2O3 film. The charge storage layer is the two layer metal nanocrystals which include the first layer metal nanocrystals, the insulating layer and the second layer metal nanocrystals grown by ALD method in sequence from bottom to up. The charge tunneling layer is the symmetrical stack layer which includes the SiO2/HfO2/SiO2 or Al2O3/HfO2/Al2O3 film grown by ALD method in sequence from bottom to up. The active region of the device is the IGZO film grown by the RF sputtering method, and it is formed by the standard lithography and wet etch method. The TFT memory in this invention has the advantage with large P/E window, good data retention, high P/E speed, stable threshold voltage and simple fabricating process.
Public/Granted literature
- US20130264632A1 THIN FILM TRANSISTOR MEMORY AND ITS FABRICATING METHOD Public/Granted day:2013-10-10
Information query
IPC分类: