发明授权
- 专利标题： Module with exposed parts of copper foil and process for production thereof
- 专利标题（中）： 具有铜箔暴露部分的模块及其制造方法
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申请号： US13496907申请日： 2010-09-30
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公开(公告)号： US08946563B2公开(公告)日： 2015-02-03
- 发明人: Takafumi Kashiwagi , Yukio Sakai , Nobuhiro Tada , Takayuki Hiruma
- 申请人： Takafumi Kashiwagi , Yukio Sakai , Nobuhiro Tada , Takayuki Hiruma
- 申请人地址： JP Osaka
- 专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： RatnerPrestia
- 优先权： JP2009-229433 20091001; JP2010-020042 20100201; JP2010-020043 20100201; JP2010-020044 20100201; JP2010-020045 20100201
- 国际申请： PCT/JP2010/005888 WO 20100930
- 国际公布： WO2011/040030 WO 20110407
- 主分类号： H05K1/16
- IPC分类号： H05K1/16 ; H05K3/28 ; H01L23/31 ; H01L23/552 ; H01L25/065 ; H01L23/00 ; H05K1/02
摘要：
A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 μm, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.
公开/授权文献
- US20120168214A1 MODULE AND PROCESS FOR PRODUCTION THEREOF 公开/授权日：2012-07-05
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