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1.发明授权公开(公告)号：US08946563B2
公开(公告)日：2015-02-03
申请号：US13496907
申请日：2010-09-30
IPC分类号： H05K1/16 , H05K3/28 , H01L23/31 , H01L23/552 , H01L25/065 , H01L23/00 , H05K1/02
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/97 , H01L2924/01019 , H01L2924/01029 , H01L2924/01078 , H01L2924/1531 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K2201/0715 , H05K2201/0723 , H05K2201/0919 , H05K2201/09309 , H05K2203/1316 , Y10T29/4913 , H01L2224/81 , H01L2924/00012
摘要： A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 μm, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.
摘要翻译： 一种模块，包括：电路板，包括绝缘层和一层或多层嵌入绝缘层中的铜箔; 安装在电路板上的电子部件; 将电子部件密封在电路板上的密封部; 以及覆盖电路板的侧面和密封部的表面的金属膜。 铜箔的一部分暴露于电路板的侧面，铜箔的露出部分的宽度小于200μm，铜箔和金属膜通过曝光 部分。 因此，可以防止发生白化，裂纹等。
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公开(公告)号：US20120168214A1
公开(公告)日：2012-07-05
申请号：US13496907
申请日：2010-09-30
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/97 , H01L2924/01019 , H01L2924/01029 , H01L2924/01078 , H01L2924/1531 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K2201/0715 , H05K2201/0723 , H05K2201/0919 , H05K2201/09309 , H05K2203/1316 , Y10T29/4913 , H01L2224/81 , H01L2924/00012
摘要： A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 μm, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.
摘要翻译： 一种模块，包括：电路板，包括绝缘层和一层或多层嵌入绝缘层中的铜箔; 安装在电路板上的电子部件; 将电子部件密封在电路板上的密封部; 以及覆盖电路板的侧面和密封部的表面的金属膜。 铜箔的一部分暴露于电路板的侧面，铜箔的露出部分的宽度小于200μm，铜箔和金属膜通过曝光 部分。 因此，可以防止发生白化，裂纹等。
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公开(公告)号：US20120306063A1
公开(公告)日：2012-12-06
申请号：US13587297
申请日：2012-08-16
申请人： Jun'ichi KIMURA , Tomohide Ogura , Takayuki Hiruma , Misao Kanba , Masahisa Nakaguchi , Motoyoshi Kitagawa
发明人： Jun'ichi KIMURA , Tomohide Ogura , Takayuki Hiruma , Misao Kanba , Masahisa Nakaguchi , Motoyoshi Kitagawa
CPC分类号： H01L24/97 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L2224/13111 , H01L2224/13139 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/81815 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/3025 , H01L2924/00015 , H01L2224/81 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a method of manufacturing a high-frequency module, a resin substrate with a high frequency circuit including an electronic component mounted thereon is placed so that the electronic component faces a resin bath. A resin which is in a non-flowable state in the resin bath is softened until the resin becomes flowable, and air in space formed between the resin substrate and the resin is sucked. The resin substrate is brought into contact with a liquid surface of the resin. The resin is pressurized and allowed to flow into a gap between the resin substrate and the electronic component. The resin is cured so that a resin portion is formed on the resin substrate. A shield metal film is formed on a surface of the resin portion.
摘要翻译： 在制造高频模块的方法中，放置具有安装在其上的电子部件的具有高频电路的树脂基板，使得电子部件面向树脂浴。 在树脂浴中处于不可流动状态的树脂软化直到树脂流动，并且吸入树脂基板和树脂之间形成的空间中的空气。 使树脂基板与树脂的液面接触。 树脂被加压并允许流入树脂基板和电子部件之间的间隙。 树脂固化，使树脂部分形成在树脂基板上。 在树脂部分的表面上形成屏蔽金属膜。
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公开(公告)号：US20120304460A1
公开(公告)日：2012-12-06
申请号：US13589782
申请日：2012-08-20
申请人： Jun'ichi Kimura , Tomohide Ogura , Takayuki Hiruma , Masahisa Nakaguchi , Misao Kanba , Motoyoshi Kitagawa
发明人： Jun'ichi Kimura , Tomohide Ogura , Takayuki Hiruma , Masahisa Nakaguchi , Misao Kanba , Motoyoshi Kitagawa
CPC分类号： H01L24/97 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L2224/13111 , H01L2224/13139 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/81815 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/19042 , H01L2924/30107 , H01L2924/3025 , Y10T29/49162 , H01L2224/85 , H01L2224/81 , H01L2924/00015 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a method for manufacturing a module, a substrate is placed above a resin bath while a electronic component is directed downward. In addition, a resin thrown into the resin bath is softened until it becomes flowable. Then, a first surface of the substrate is brought into contact with a liquid surface of the softened resin. The softened resin is allowed to flow forcibly into a gap between the substrate and the electronic component. Then, the resin cures, and a resin portion is formed. Further, a metal thin film is formed on the surface of the resin portion by sputtering to form the shield metal film.
摘要翻译： 在制造模块的方法中，将基板放置在树脂熔池的上方，同时将电子部件向下引导。 此外，投入树脂浴中的树脂软化直到其变得可流动。 然后，使基板的第一表面与软化树脂的液面接触。 使软化的树脂强制地流入基板和电子部件之间的间隙。 然后，树脂固化，形成树脂部分。 此外，通过溅射在树脂部分的表面上形成金属薄膜以形成屏蔽金属膜。
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