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公开(公告)号：US20140110153A1
公开(公告)日：2014-04-24
申请号：US13995088
申请日：2013-01-11
申请人： Takafumi Kashiwagi , Eri Kamada , Yoshiki Okushima , Hideki Niimi , Ayako Iwasawa , Tadashi Nakamura
发明人： Takafumi Kashiwagi , Eri Kamada , Yoshiki Okushima , Hideki Niimi , Ayako Iwasawa , Tadashi Nakamura
CPC分类号： H05K1/092 , B22F1/0074 , B23K35/262 , C22C1/0425 , C22C9/00 , C22C9/02 , C22C12/00 , C22C30/02 , C22C30/04 , H05K1/095 , H05K1/115 , H05K3/0094 , H05K3/4069 , H05K3/4652 , H05K2201/0272 , H05K2203/0425 , Y10T29/49155
摘要： A wiring board includes an insulating resin layer, wirings, and a via-hole conductor. The wirings are disposed through the insulating resin layer therebetween and formed of copper foils. The via-hole conductor penetrates through the insulating resin layer and electrically connects the wirings together. The via-hole conductor includes a resin portion and a metal portion containing copper, tin, and bismuth. The metal portion includes a first metal region including a link of copper particles, a second metal region including, as a main component, at least one of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region including bismuth as a main component. The copper particles partially include a plane-to-plane contact with a roughened surface of the copper foil, and the second metal region is partially formed on a surface of the link and on the roughened surface of the copper foil.
摘要翻译： 布线板包括绝缘树脂层，布线和通孔导体。 布线通过其间的绝缘树脂层布置并由铜箔形成。 通孔导体穿过绝缘树脂层并将布线电连接在一起。 通孔导体包括树脂部分和含有铜，锡和铋的金属部分。 金属部分包括包括铜颗粒的连接的第一金属区域，包括锡，锡 - 铜合金和锡 - 铜金属间化合物中的至少一种作为主要成分的第二金属区域，以及第三金属区域 区域包括铋作为主要成分。 铜颗粒部分地包括与铜箔的粗糙表面的平面接触，并且第二金属区域部分地形成在连接件的表面和铜箔的粗糙表面上。
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公开(公告)号：US06871974B2
公开(公告)日：2005-03-29
申请号：US10607579
申请日：2003-06-27
申请人： Takafumi Kashiwagi , Yasuhiro Katou
发明人： Takafumi Kashiwagi , Yasuhiro Katou
CPC分类号： G02B6/0018 , G02B6/0036 , G02B6/0043
摘要： A lighting unit has a light guiding plate having a plurality of corner portions each of which is formed by intersecting adjacent two side surfaces. The side surface between a pair of the corner portions of the light guiding plate forms a light incident face Non-light-emitting portions of a light source correspond to the pair of the corner portions of the light guiding plate, and at least one of the corner portions has an inclined face in contact with the light incident face, the side surface adjacent to the light incident face, and at least one of the top surface and bottom surface, and inclined by an angle θ (90°
摘要翻译： 照明单元具有导光板，该导光板具有多个角部，每个角部通过相邻的两个侧表面相交而形成。 导光板的一对角部之间的侧面形成光入射面，光源的非发光部分对应于导光板的一对角部，并且至少一个 角部具有与光入射面，邻近光入射面的侧表面以及顶表面和底表面中的至少一个倾斜角度θ（90°<180°）的倾斜面 ）相对于顶表面或底表面。
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3.发明授权公开(公告)号：US08946563B2
公开(公告)日：2015-02-03
申请号：US13496907
申请日：2010-09-30
IPC分类号： H05K1/16 , H05K3/28 , H01L23/31 , H01L23/552 , H01L25/065 , H01L23/00 , H05K1/02
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/97 , H01L2924/01019 , H01L2924/01029 , H01L2924/01078 , H01L2924/1531 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K2201/0715 , H05K2201/0723 , H05K2201/0919 , H05K2201/09309 , H05K2203/1316 , Y10T29/4913 , H01L2224/81 , H01L2924/00012
摘要： A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 μm, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.
摘要翻译： 一种模块，包括：电路板，包括绝缘层和一层或多层嵌入绝缘层中的铜箔; 安装在电路板上的电子部件; 将电子部件密封在电路板上的密封部; 以及覆盖电路板的侧面和密封部的表面的金属膜。 铜箔的一部分暴露于电路板的侧面，铜箔的露出部分的宽度小于200μm，铜箔和金属膜通过曝光 部分。 因此，可以防止发生白化，裂纹等。
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公开(公告)号：US20120168214A1
公开(公告)日：2012-07-05
申请号：US13496907
申请日：2010-09-30
CPC分类号： H05K3/284 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/97 , H01L2924/01019 , H01L2924/01029 , H01L2924/01078 , H01L2924/1531 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K2201/0715 , H05K2201/0723 , H05K2201/0919 , H05K2201/09309 , H05K2203/1316 , Y10T29/4913 , H01L2224/81 , H01L2924/00012
摘要： A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 μm, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.
摘要翻译： 一种模块，包括：电路板，包括绝缘层和一层或多层嵌入绝缘层中的铜箔; 安装在电路板上的电子部件; 将电子部件密封在电路板上的密封部; 以及覆盖电路板的侧面和密封部的表面的金属膜。 铜箔的一部分暴露于电路板的侧面，铜箔的露出部分的宽度小于200μm，铜箔和金属膜通过曝光 部分。 因此，可以防止发生白化，裂纹等。
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