发明授权
US08950519B2 Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both
有权
具有分隔的基底，多晶金刚石台或两者的多晶金刚石压块
- 专利标题： Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both
- 专利标题（中）： 具有分隔的基底，多晶金刚石台或两者的多晶金刚石压块
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申请号： US13234252申请日： 2011-09-16
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公开(公告)号： US08950519B2公开(公告)日： 2015-02-10
- 发明人: Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
- 申请人： Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
- 申请人地址： US UT Orem
- 专利权人： US Synthetic Corporation
- 当前专利权人： US Synthetic Corporation
- 当前专利权人地址： US UT Orem
- 代理机构： Dorsey & Whitney LLP
- 主分类号： E21B10/46
- IPC分类号： E21B10/46
摘要：
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
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