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公开(公告)号：US20140366456A1
公开(公告)日：2014-12-18
申请号：US13166007
申请日：2011-06-22
CPC分类号： B24D18/00 , B23K26/364 , B24D3/04 , E21B10/46 , E21B10/567 , E21B10/5673 , E21B10/5676
摘要： Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.
摘要翻译： 公开了激光切割多晶金刚石台和多晶金刚石压块的方法。 多晶金刚石台的激光切割提供放电加工（“EDM”），用金刚石砂轮研磨或用金刚石砂轮研磨的替代方案。 用金刚石砂轮磨削或研磨相对较慢且昂贵，因为金刚石用于去除金刚石材料。 多晶金刚石台的电火花切割有时是不实际的或甚至是不可能的，特别是当多晶金刚石台中的钴或其他渗透剂或催化剂浓度非常低时（例如在浸出的多晶金刚石台的情况下）。 因此，激光切割提供了可用于各种工艺（例如激光划线，激光烧蚀和激光研磨）中的有价值的替代加工方法。
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2.发明授权Polycrystalline diamond compacts with partitioned substrate, polycrystalline diamond table, or both 有权具有分隔的基底，多晶金刚石台或两者的多晶金刚石压块公开(公告)号：US08950519B2
公开(公告)日：2015-02-10
申请号：US13234252
申请日：2011-09-16
申请人： Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
发明人： Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
IPC分类号： E21B10/46
CPC分类号： E21B10/567 , B24D18/00 , E21B4/003 , E21B10/55 , E21B10/5673 , E21B10/5676 , E21B10/5735 , F16C33/04 , F16C33/043 , F16C2206/04 , F16C2352/00
摘要： Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
摘要翻译： 在多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中至少部分减轻应力的方法包括分割PDC的基底，PDC的PCD表或两者。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 PDC实施例可以包括至少一个应力消除分区。
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3.发明申请POLYCRYSTALLINE DIAMOND COMPACTS WITH PARTITIONED SUBSTRATE, POLYCRYSTALLINE DIAMOND TABLE, OR BOTH 有权具有分层基体的多晶金刚石复合材料，多晶金刚石表，或两面公开(公告)号：US20140367176A1
公开(公告)日：2014-12-18
申请号：US13234252
申请日：2011-09-16
申请人： Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
发明人： Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
CPC分类号： E21B10/567 , B24D18/00 , E21B4/003 , E21B10/55 , E21B10/5673 , E21B10/5676 , E21B10/5735 , F16C33/04 , F16C33/043 , F16C2206/04 , F16C2352/00
摘要： Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments may include at least one stress relieving partition.
摘要翻译： 在多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中至少部分减轻应力的方法包括分割PDC的基底，PDC的PCD表或两者。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 PDC实施例可以包括至少一个应力消除分区。
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4.发明授权公开(公告)号：US09770807B1
公开(公告)日：2017-09-26
申请号：US12558939
申请日：2009-09-14
申请人： David P. Miess , Mark P. Chapman , Steven L. Choate , D. Bart Crockett , Jeffery A. Gerber , Jair J. Gonzalez
发明人： David P. Miess , Mark P. Chapman , Steven L. Choate , D. Bart Crockett , Jeffery A. Gerber , Jair J. Gonzalez
CPC分类号： B24D18/00 , B24D3/00 , B24D18/0009 , B24D99/005 , C04B35/52 , C04B35/645 , C04B37/026 , C04B2235/427 , C04B2235/5436 , C04B2235/5472 , C04B2235/80 , C04B2237/363 , C04B2237/401 , C04B2237/61
摘要： Embodiments of the invention relate to non-cylindrical polycrystalline diamond compacts (“PDCs”), and methods of fabricating such non-cylindrical PDCs without substantially undercutting a cemented carbide substrate thereof from an overlying polycrystalline diamond (“PCD”) table thereof. According to various embodiments, a PDC includes a PCD table including an upper surface and a table non-cylindrical lateral periphery. The PDC includes a cemented carbide substrate bonded to the PCD table. In an embodiment, the cemented carbide substrate includes a substrate non-cylindrical lateral periphery that is not substantially undercut from the table non-cylindrical lateral periphery of the PCD table. In an embodiment, the PDC includes at least one alignment feature positioned on the cemented carbide substrate and/or the PCD table.
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公开(公告)号：US09297411B2
公开(公告)日：2016-03-29
申请号：US13432224
申请日：2012-03-28
申请人： S Barrett Peterson , Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
发明人： S Barrett Peterson , Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
IPC分类号： F16C17/04 , B21K1/04 , F16C17/02 , F16C33/02 , E21B4/00 , F16C37/00 , F16C33/04 , F16C33/10 , F16C33/26 , E21B17/03
CPC分类号： F16C33/108 , B21K1/04 , E21B4/003 , E21B17/03 , F16C17/02 , F16C17/04 , F16C33/043 , F16C33/1085 , F16C33/26 , F16C37/002 , F16C2206/04 , F16C2206/82 , F16C2240/42 , F16C2240/48 , F16C2352/00 , Y10T29/49645
摘要： Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements.
摘要翻译： 公开了使用其的轴承组件，装置和电动机组件。 在一个实施例中，轴承组件可以包括围绕轴线周向分布的多个超硬轴承元件。 每个超硬轴承元件可以包括支承表面。 多个超硬轴承元件中的至少一个可以包括可以在其侧表面中形成的至少一个纹理特征。 轴承组件还可以包括承载超硬轴承元件的支撑环。
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6.发明授权公开(公告)号：US08784517B1
公开(公告)日：2014-07-22
申请号：US12717158
申请日：2010-03-04
申请人： Jair J. Gonzalez , David P. Miess , Mark P. Chapman , Steven L. Choate , D. Bart Crockett , Jeffery A. Gerber
发明人： Jair J. Gonzalez , David P. Miess , Mark P. Chapman , Steven L. Choate , D. Bart Crockett , Jeffery A. Gerber
CPC分类号： B24D18/00 , B24D3/00 , B24D18/0009 , B24D99/005 , C04B35/52 , C04B35/645 , C04B37/026 , C04B2235/427 , C04B2235/5436 , C04B2235/5472 , C04B2235/80 , C04B2237/363 , C04B2237/401 , C04B2237/61
摘要： Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) including a pre-sintered polycrystalline diamond (“PCD”) table that may exhibit a non-cylindrical-shaped geometry and/or may have been partially graphitized prior to bonding to a substrate in a high-pressure/high-temperature process (“HPHT”). The disclosed PDCs may be used in a variety of applications, such as rotary drill bits, mining tools, drill bits, bearing apparatuses, wire-drawing dies, machining equipment, and other articles and apparatuses.
摘要翻译： 本发明的实施方案涉及包括预烧结多晶金刚石（“PCD”）表的多晶金刚石压块（“PDC”），其可以呈现非圆柱形几何形状，和/或可能在结合到 基板在高压/高温过程（“HPHT”）中。 所公开的PDC可以用于各种应用中，例如旋转钻头，采矿工具，钻头，轴承装置，拉丝模具，机械设备和其它物品和装置。
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公开(公告)号：US20130156357A1
公开(公告)日：2013-06-20
申请号：US13432224
申请日：2012-03-28
申请人： S. Barrett Peterson , Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
发明人： S. Barrett Peterson , Jair J. Gonzalez , Kenneth E. Bertagnolli , Debkumar Mukhopadhyay , David P. Miess , Mark P. Chapman , Ronald W. Ward , Nicholas Christensen , Damon B. Crockett , Mohammad N. Sani
CPC分类号： F16C33/108 , B21K1/04 , E21B4/003 , E21B17/03 , F16C17/02 , F16C17/04 , F16C33/043 , F16C33/1085 , F16C33/26 , F16C37/002 , F16C2206/04 , F16C2206/82 , F16C2240/42 , F16C2240/48 , F16C2352/00 , Y10T29/49645
摘要： Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements.
摘要翻译： 公开了使用其的轴承组件，装置和电动机组件。 在一个实施例中，轴承组件可以包括围绕轴线周向分布的多个超硬轴承元件。 每个超硬轴承元件可以包括支承表面。 多个超硬轴承元件中的至少一个可以包括可以在其侧表面中形成的至少一个纹理特征。 轴承组件还可以包括承载超硬轴承元件的支撑环。
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公开(公告)号：US09062505B2
公开(公告)日：2015-06-23
申请号：US13166007
申请日：2011-06-22
IPC分类号： E21B10/46 , E21B10/567
CPC分类号： B24D18/00 , B23K26/364 , B24D3/04 , E21B10/46 , E21B10/567 , E21B10/5673 , E21B10/5676
摘要： Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.
摘要翻译： 公开了激光切割多晶金刚石台和多晶金刚石压块的方法。 多晶金刚石台的激光切割提供放电加工（“EDM”），用金刚石砂轮研磨或用金刚石砂轮研磨的替代方案。 用金刚石砂轮磨削或研磨相对较慢且昂贵，因为金刚石用于去除金刚石材料。 多晶金刚石台的电火花切割有时是不实际的或甚至是不可能的，特别是当多晶金刚石台中的钴或其他渗透剂或催化剂浓度非常低时（例如在浸出的多晶金刚石台的情况下）。 因此，激光切割提供了可用于各种工艺（例如激光划线，激光烧蚀和激光研磨）中的有价值的替代加工方法。
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