A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.