公开(公告)号：US08950652B2

公开(公告)日：2015-02-10

申请号：US13393032

申请日：2010-09-03

申请人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

发明人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

IPC分类号： B23K35/22 ,  B23K35/26 ,  B23K35/34 ,  B22F1/00 ,  B22F3/10 ,  B22F7/04 ,  B23K35/02 ,  B23K35/36 ,  B23K35/365 ,  H01L23/00

CPC分类号： B23K35/34 ,  B22F1/0062 ,  B22F3/1003 ,  B22F7/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/3602 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014

摘要： A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

摘要翻译： 提供一种烧结方法，其允许组件以稳定的方式彼此接合，其中处理温度低于200℃，并且产生稳定的接触点，其具有低孔隙率和高导电性和高导热性。 接合部件的方法包括（a）提供具有至少（a1）一种组分1，（a2）一种组分2和（a3）位于组分1和组分2之间的金属糊剂的夹层结构，和（b）烧结 三明治安排。 金属糊含有（A）75-90重量％的至少一种以颗粒形式存在的至少一种金属，其具有包含至少一种有机化合物的涂层，（B）0-12重量％的至少一种金属前体，（C ）6-20重量％的至少一种溶剂，和（D）0.1-15重量％的至少一种选自以下的烧结剂：（i）有机过氧化物，（ii）无机过氧化物和（iii）无机酸 。

公开(公告)号：US20120153011A1

公开(公告)日：2012-06-21

申请号：US13393032

申请日：2010-09-03

申请人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

发明人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

IPC分类号： B23K31/02 ,  B23K35/24

CPC分类号： B23K35/34 ,  B22F1/0062 ,  B22F3/1003 ,  B22F7/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/3602 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  B23K2101/36 ,  H01L24/83 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014

摘要： A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

摘要翻译： 提供一种烧结方法，其允许组件以稳定的方式彼此接合，其中处理温度低于200℃，并且产生稳定的接触点，其具有低孔隙率和高导电性和高导热性。 接合部件的方法包括（a）提供具有至少（a1）一种组分1，（a2）一种组分2和（a3）位于组分1和组分2之间的金属糊剂的夹层结构，和（b）烧结 三明治安排。 金属糊含有（A）75-90重量％的至少一种以颗粒形式存在的至少一种金属，所述金属具有包含至少一种有机化合物的涂层，（B）0-12重量％的至少一种金属前体，（C ）6-20重量％的至少一种溶剂，和（D）0.1-15重量％的至少一种选自以下的烧结剂：（i）有机过氧化物，（ii）无机过氧化物和（iii）无机酸 。

公开(公告)号：US08950653B2

公开(公告)日：2015-02-10

申请号：US13393241

申请日：2010-09-03

申请人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

发明人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

IPC分类号： B23K35/22 ,  B23K35/26 ,  B23K35/36 ,  B22F1/00 ,  B22F3/10 ,  B22F7/04 ,  B23K35/02 ,  B23K35/28 ,  B23K35/30 ,  B23K35/34 ,  H01L23/00

CPC分类号： B23K35/3618 ,  B22F1/0062 ,  B22F3/1003 ,  B22F7/04 ,  B23K35/025 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/34 ,  H01L24/83 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/00

摘要： A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200° C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12wt % of at least one metal precursor, (C) 6-20wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C1-C4 organic acids, (ii) esters of C1-C4 organic acids, and (iii) carbonyl complexes.

摘要翻译： 烧结方法允许组件以低于200℃的加工温度以稳定的方式彼此接合，产生具有低孔隙率和高导电性和导热性的稳定的接触点。 该方法包括（a）提供具有位于第一和第二部件之间的至少第一部件，第二部件和金属膏的夹层结构，和（b）烧结夹层结构。 金属糊包括（A）75-90重量％ 至少一种以具有含有机化合物的涂层的颗粒形式存在的至少一种金属，（B）0-12重量％的至少一种金属前体，（C）6-20重量％的至少一种溶剂和（D ）0.1-15重量％的至少一种选自（i）C1-C4有机酸盐，（ii）C1-C4有机酸酯和（iii）羰基络合物）的烧结剂。

公开(公告)号：US20120153012A1

公开(公告)日：2012-06-21

申请号：US13393241

申请日：2010-09-03

申请人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

发明人： Michael Schäfer ,  Wolfgang Schmitt ,  Jian Zeng

IPC分类号： B23K31/02 ,  H01B1/22

CPC分类号： B23K35/3618 ,  B22F1/0062 ,  B22F3/1003 ,  B22F7/04 ,  B23K35/025 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/34 ,  H01L24/83 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/00

摘要： A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200° C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12 wt % of at least one metal precursor, (C) 6-20 wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C1-C4 organic acids, (ii) esters of C1-C4 organic acids, and (iii) carbonyl complexes.

摘要翻译： 烧结方法允许组件以低于200℃的加工温度以稳定的方式彼此接合，产生具有低孔隙率和高导电性和导热性的稳定的接触点。 该方法包括（a）提供具有位于第一和第二部件之间的至少第一部件，第二部件和金属膏的夹层结构，和（b）烧结夹层结构。 金属糊包括（A）75-90重量％ 至少一种以具有含有机化合物的涂层的颗粒形式存在的至少一种金属，（B）0-12重量％的至少一种金属前体，（C）6-20重量％的至少一种溶剂，以及 （D）0.1-15重量％的至少一种选自（i）C1-C4有机酸盐，（ii）C1-C4有机酸酯和（iii）羰基络合物）的烧结剂。

公开(公告)号：US08925789B2

公开(公告)日：2015-01-06

申请号：US13224514

申请日：2011-09-02

申请人： Michael Schäfer ,  Wolfgang Schmitt

发明人： Michael Schäfer ,  Wolfgang Schmitt

IPC分类号： B23K35/22 ,  B22F1/00 ,  B22F1/02 ,  B22F7/06 ,  B22F7/08 ,  H01L23/00

CPC分类号： B22F1/0062 ,  B22F1/007 ,  B22F1/0074 ,  B22F1/02 ,  B22F7/064 ,  B22F7/08 ,  C09D4/00 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/27442 ,  H01L2224/27505 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83464 ,  H01L2224/83469 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/01046 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2224/05552

摘要： A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.

摘要翻译： 提供一种用于连接至少两个组件的方法，其中使用烧结预成型件。 该预型件包括具有至少一个包含硬化浆料的结构元件的表面的载体，其中硬化浆料包含：（a）具有包含至少一种有机化合物的涂层的金属颗粒; 和（b）至少一种选自（b1）有机过氧化物，（b2）无机过氧化物，（b3）无机酸，（b4）有机酸盐的组合的烧结助剂，其中有机酸具有1-4个碳原子 原子，（b5）有机酸的酯，其中有机酸具有1-4个碳原子，和（b6）羰基络合物。 具有硬化浆料的载体的表面不与糊料的组分反应。

公开(公告)号：US07655867B2

公开(公告)日：2010-02-02

申请号：US10595197

申请日：2004-09-06

申请人： Michael Schäfer

发明人： Michael Schäfer

IPC分类号： H01B7/00

CPC分类号： H01F27/322 ,  H01F27/323

摘要： A conductor for windings cooled by liquid, especially for transformer windings, has an insulating covering which surrounds the entire conductor (1). At least one layer (2) of the covering completely surrounds the conductor (1). An external layer (3) provided with at least two layers (2, 3) of the covering comprises openings (4), holes (5) or frays (6) through which a coolant flowing around the conductor is placed in a turbulent state and better heat exchange is obtained.

摘要翻译： 用于由液体冷却的绕组的导体，特别是用于变压器绕组的绕组的导体具有围绕整个导体（1）的绝缘覆盖物。 覆盖物的至少一层（2）完全包围导体（1）。 设置有至少两层（2,3）的外壳的外层（3）包括开口（4），孔（5）或玻璃（6），使围绕导体流动的冷却剂通过该开口放置在湍流状态， 获得更好的热交换。

公开(公告)号：US07602497B2

公开(公告)日：2009-10-13

申请号：US10559545

申请日：2004-07-01

申请人： Jan Berg ,  Jürgen Lohmann ,  Michael Schäfer ,  Jürgen Ettmüller

发明人： Jan Berg ,  Jürgen Lohmann ,  Michael Schäfer ,  Jürgen Ettmüller

IPC分类号： G01N21/47

CPC分类号： G01N21/474 ,  G01N2021/4742 ,  G01N2021/4754 ,  G01N2021/4757 ,  G01N2021/4759 ,  G01N2021/4769

摘要： The invention relates to reflectance sensors built up from an optical unit, a sample analysis unit and a system control unit, and to a method of measuring the reflectance of a sample in the form of a liquid pigment preparation, and to the use of a reflectance sensor according to the invention for the measurement of the reflectance of liquid pigment preparations in various process stages during the production, further processing and use of the liquid pigment preparations.

摘要翻译： 本发明涉及由光学单元，样品分析单元和系统控制单元构成的反射率传感器，以及测量液体颜料制剂形式的样品的反射率的方法，以及使用反射率 传感器，用于在液体颜料制备的生产，进一步加工和使用期间测量各种工艺阶段中的液体颜料制剂的反射率。

公开(公告)号：US20100275681A1

公开(公告)日：2010-11-04

申请号：US12086987

申请日：2006-12-20

申请人： Michael Ritschel ,  Ludwig Moch ,  Michael Schäfer

发明人： Michael Ritschel ,  Ludwig Moch ,  Michael Schäfer

IPC分类号： G01M13/02

CPC分类号： G01M13/022

摘要： The invention relates to a method for measuring the uniformity of the moments of shiftable friction clutch systems, the individual friction clutch system comprising an adapter at the input end and at least one adapter at the output end, as well as a system for measuring the uniformity of the moments of shiftable friction clutch systems. According to the invention, the friction clutch system is inserted into a measuring apparatus encompassing at least one moment measuring device. The clutch plates that transmit the driving power in a frictionally engaged manner are pressed against each other by means of a test force. The driving motor is driven at a certain test speed. The torque of the driving motor transmitted by means of the friction clutch system is measured within a certain interval with the aid of the moment measuring device. The inventive test method and measuring apparatus developed for a friction clutch system allow the friction clutch system to be measured and tested before the same is mounted on a transmission.

摘要翻译： 本发明涉及一种用于测量可移动摩擦离合器系统的力矩的均匀性的方法，该单独的摩擦离合器系统包括在输入端的适配器和在输出端的至少一个适配器，以及用于测量均匀性的系统 的可移动摩擦离合器系统的时刻。 根据本发明，摩擦离合器系统被插入到包含至少一个力矩测量装置的测量装置中。 以摩擦接合的方式传递驱动力的离合器片通过测试力彼此挤压。 驱动电机以一定的测试速度驱动。 通过摩擦离合器系统传递的驱动电机的扭矩在一定的时间间隔内借助力矩测量装置进行测量。 为摩擦离合器系统开发的本发明的测试方法和测量装置允许在将摩擦离合器系统安装在变速器上之前进行测量和测试。

公开(公告)号：US07182287B2

公开(公告)日：2007-02-27

申请号：US10494216

申请日：2002-11-09

申请人： Wolfgang Denker ,  Michael Schäfer

发明人： Wolfgang Denker ,  Michael Schäfer

IPC分类号： B65H19/22

CPC分类号： B21C47/24

摘要： The invention relates to a gripper for residual windings (1), which may be wound from residual strip (2), running from strip plants at the roll end, where said gripper can be pivoted or displaced about a strip plant and which can be embodied for a more rational operation mode, whereby the gripper (3), in addition to the function there of as drawing device (3a), is embodied as winding device (3b).

摘要翻译： 本发明涉及一种用于残余绕组（1）的夹持器，其可以从残留条带（2）卷绕，从辊端处的带状植物运行，其中所述夹持器可围绕条带植物枢转或移位，并且可以被实施 为了更合理的操作模式，除了作为牵引装置（3a）的功能之外，夹具（3）被实施为卷绕装置（3b）。

公开(公告)号：US06592949B1

公开(公告)日：2003-07-15

申请号：US09708026

申请日：2000-11-08

申请人： Reinhard Polke ,  Michael Schäfer ,  Martin Welz ,  Manfred Reimann

发明人： Reinhard Polke ,  Michael Schäfer ,  Martin Welz ,  Manfred Reimann

IPC分类号： B05D306

CPC分类号： B41M7/009 ,  B41M7/0081

摘要： A method of marking a plastics surface comprises at least the following steps: a) applying a composition comprising at least one coloring component to a plastics surface, b) irradiating the plastics surface with light from a light source.

摘要翻译： 标记塑料表面的方法至少包括以下步骤：a）将包含至少一种着色组分的组合物施加到塑料表面，b）用来自光源的光照射塑料表面。