Invention Grant
- Patent Title: Curved plate and method of forming the same
- Patent Title (中): 弯曲板及其形成方法
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Application No.: US13852676Application Date: 2013-03-28
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Publication No.: US08951425B2Publication Date: 2015-02-10
- Inventor: Stéphane Monfray , Thomas Skotnicki , Onoriu Puscasu , Christophe Maitre
- Applicant: STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Crolles
- Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Crolles
- Agency: Seed IP Law Group PLLC
- Priority: FR1252997 20120402
- Main IPC: C23F1/02
- IPC: C23F1/02 ; H01L41/332 ; H01L41/113 ; H02N2/18 ; B05D3/02 ; B05D3/10 ; H01L41/27 ; H01L41/33

Abstract:
A method of forming at least one curved plate having first and second layers, the first layer being formed of a first material and the second layer being formed of a second material, the method including forming one or more blocks of a fusible material on a surface of a substrate; baking the one or more blocks to deform their shape; and depositing the first and second materials over the one or more deformed blocks to form the first and second layers.
Public/Granted literature
- US20130280549A1 CURVED PLATE AND METHOD OF FORMING THE SAME Public/Granted day:2013-10-24
Information query
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