发明授权
US08958574B2 Strain and pressure sensing device, microphone, method for manufacturing strain and pressure sensing device, and method for manufacturing microphone
有权
应变和压力感测装置,麦克风,制造应变和压力感测装置的方法以及制造麦克风的方法
- 专利标题: Strain and pressure sensing device, microphone, method for manufacturing strain and pressure sensing device, and method for manufacturing microphone
- 专利标题(中): 应变和压力感测装置,麦克风,制造应变和压力感测装置的方法以及制造麦克风的方法
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申请号: US13536002申请日: 2012-06-28
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公开(公告)号: US08958574B2公开(公告)日: 2015-02-17
- 发明人: Hideaki Fukuzawa , Tatsuya Ohguro , Akihiro Kojima , Yoshiaki Sugizaki , Mariko Takayanagi , Yoshihiko Fuji , Akio Hori , Michiko Hara
- 申请人: Hideaki Fukuzawa , Tatsuya Ohguro , Akihiro Kojima , Yoshiaki Sugizaki , Mariko Takayanagi , Yoshihiko Fuji , Akio Hori , Michiko Hara
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2011-211212 20110927
- 主分类号: H04R3/00
- IPC分类号: H04R3/00 ; G01L9/00 ; H04R1/08 ; B81C1/00 ; H04R19/00 ; H04R19/04 ; H04R31/00
摘要:
According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion.
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