发明授权
- 专利标题: Apparatus and methods for processing a substrate
- 专利标题(中): 用于处理衬底的装置和方法
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申请号: US13251064申请日: 2011-09-30
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公开(公告)号: US08968485B2公开(公告)日: 2015-03-03
- 发明人: Arjun Mendiratta , Cheng-Yu Lin , David Mui
- 申请人: Arjun Mendiratta , Cheng-Yu Lin , David Mui
- 申请人地址: US CA Fremont
- 专利权人: Lam Research Corporation
- 当前专利权人: Lam Research Corporation
- 当前专利权人地址: US CA Fremont
- 代理机构: Martine Penilla Group, LLP
- 主分类号: B08B3/00
- IPC分类号: B08B3/00 ; B08B1/02 ; B08B3/04 ; H01L21/02 ; H01L21/67
摘要:
An apparatus for processing a substrate, comprising: a process chamber having a track; a carrier connected to the track; upper and lower proximity heads in the chamber and positioned along the path, the proximity heads having opposing faces that define a gap in which a meniscus of fluid is formed, the path being defined along the gap between the opposing faces; a first pre-wet dispenser and a second pre-wet dispenser disposed along side of the upper proximity head and directed toward the path; a drive for moving each of the pre-wet dispensers between a center position along the length of the upper proximity head and opposite outer positions near outer ends of the upper proximity head; and a pre-wet controller for causing the drive to move each of the first and second pre-wet dispensers based on a position of the carrier when moved under the first and second pre-wet dispensers.
公开/授权文献
- US20130081655A1 APPARATUS AND METHODS FOR PROCESSING A SUBSTRATE 公开/授权日:2013-04-04
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