发明授权
- 专利标题: Sputtering target having increased life and sputtering uniformity
- 专利标题(中): 溅射靶材寿命延长和溅射均匀性
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申请号: US11764772申请日: 2007-06-18
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公开(公告)号: US08968536B2公开(公告)日: 2015-03-03
- 发明人: Adolph Miller Allen , Ki Hwan Yoon , Ted Guo , Hong S. Yang , Sang-Ho Yu
- 申请人: Adolph Miller Allen , Ki Hwan Yoon , Ted Guo , Hong S. Yang , Sang-Ho Yu
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Janah & Associates, P.C.
- 代理商 Ashok K. Janah
- 主分类号: C23C14/35
- IPC分类号: C23C14/35 ; C23C14/34 ; H01J37/34
摘要:
A sputtering target for a sputtering chamber comprises a backing plate with a sputtering plate mounted thereon. In one version, the backing plate comprises a circular plate having a front surface comprising an annular groove. The sputtering plate comprises a disk comprising a sputtering surface and a backside surface having a circular ridge that is shaped and sized to fit into the annular groove of the backing plate.
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