Invention Grant
US08971161B2 Devices including at least one adhesion layer and methods of forming adhesion layers
有权
包括至少一个粘合层的装置和形成粘合层的方法
- Patent Title: Devices including at least one adhesion layer and methods of forming adhesion layers
- Patent Title (中): 包括至少一个粘合层的装置和形成粘合层的方法
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Application No.: US14313574Application Date: 2014-06-24
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Publication No.: US08971161B2Publication Date: 2015-03-03
- Inventor: Yuhang Cheng , Tong Zhao , Michael C. Kautzky , Ed F. Rejda , Kurt W. Wierman , Scott Franzen , Andrew J. Boyne , Michael Allen Seigler , Sethuraman Jayashankar
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Mueting, Raasch & Gebhardt, P.A.
- Main IPC: G11B11/00
- IPC: G11B11/00 ; G11B5/84 ; G11B5/48 ; B05D1/36 ; G11B5/85 ; G11B5/851 ; G11B5/858 ; G11B5/00

Abstract:
Devices that include a near field transducer (NFT), the NFT having a disc and a peg, and the peg having five surfaces thereof; and at least one adhesion layer positioned on at least one of the five surfaces of the peg, the adhesion layer including one or more of the following: rhenium, osmium, iridium, platinum, hafnium, ruthenium, technetium, rhodium, palladium, beryllium, aluminum, manganese, indium, boron, and combinations thereof beryllium oxide, silicon oxide, iron oxide, zirconium oxide, manganese oxide, cadmium oxide, magnesium oxide, hafnium oxide, and combinations thereof tantalum carbide, uranium carbide, hafnium carbide, zirconium carbide, scandium carbide, manganese carbide, iron carbide, niobium carbide, technetium carbide, rhenium carbide, and combinations thereof chromium nitride, boron nitride, and combinations thereof.
Public/Granted literature
- US20140376349A1 DEVICES INCLUDING AT LEAST ONE ADHESION LAYER AND METHODS OF FORMING ADHESION LAYERS Public/Granted day:2014-12-25
Information query
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